公开(公告)号：US20180151343A1

公开(公告)日：2018-05-31

申请号：US15824274

申请日：2017-11-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshiki OKAMOTO ,  Hayato HOSAKA ,  Teruhiko KODAMA ,  Akihiro KUBO ,  Ryuto OZASA ,  Yuji ARIUCHI ,  Shinsuke KIMURA

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  G03F7/20

CPC classification number: H01L21/02016 ,  G03F7/70691 ,  H01L21/0209 ,  H01L21/67046 ,  H01L21/67219 ,  H01L21/67225 ,  H01L21/67288 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68764 ,  H01L21/68792

Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.