公开(公告)号：US20150036109A1

公开(公告)日：2015-02-05

申请号：US14449419

申请日：2014-08-01

申请人： TOKYO ELECTRON LIMITED

发明人： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Masahiro FUKUDA

IPC分类号： G03F7/30

CPC分类号： G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

摘要： A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

摘要翻译： 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。

公开(公告)号：US20170090291A1

公开(公告)日：2017-03-30

申请号：US15374081

申请日：2016-12-09

申请人： Tokyo Electron Limited

发明人： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Masahiro FUKUDA

IPC分类号： G03F7/30 ,  B05C11/08 ,  B05C5/02 ,  B05D1/00 ,  B05D1/26

CPC分类号： G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

摘要： A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.

公开(公告)号：US20160026086A1

公开(公告)日：2016-01-28

申请号：US14801096

申请日：2015-07-16

申请人： TOKYO ELECTRON LIMITED

发明人： Masahiro FUKUDA ,  Taro YAMAMOTO

IPC分类号： G03F7/30

CPC分类号： G03F7/30 ,  G03F7/3021

摘要： A developing apparatus includes a first cup module and a second cup module arranged to be spaced apart from each other in a transverse direction; a first developing solution nozzle configured to wait in a standby position between the first cup module and the second cup module; and a first moving mechanism configured to move the first developing solution nozzle between the standby position and a processing position in which the developing solution is supplied to the substrate, wherein the first developing solution nozzle includes an ejection hole configured to eject the developing solution to form a liquid puddle on a surface of the substrate, the first developing solution nozzle includes a contact portion formed smaller than the surface of the substrate and installed to face the surface of the substrate, and the first developing solution nozzle spreads the liquid puddle on the substrate.

摘要翻译： 显影装置包括：第一杯模块和第二杯模块，其布置成在横向上彼此间隔开; 第一显影剂溶液喷嘴，被配置为在第一杯模块和第二杯模块之间的待机位置中等待; 以及第一移动机构，其构造成将所述第一显影液喷嘴在备用位置和将所述显影液供给到所述基板的处理位置之间移动，其中所述第一显影液喷嘴包括喷射孔，所述喷射孔被配置为喷射所述显影液以形成 所述第一显影液喷嘴包括形成为比所述基板的表面小的并且被安装成面向所述基板的表面的接触部，并且所述第一显影液喷嘴将所述液体熔池在所述基板上展开 。

公开(公告)号：US20150318193A1

公开(公告)日：2015-11-05

申请号：US14651816

申请日：2013-12-12

申请人： TOKYO ELECTRON LIMITED

发明人： Masahiro FUKUDA ,  Akihiro KUBO ,  Taro YAMAMOTO ,  Kenzi YADA ,  Atsushi OOKOUCHI

IPC分类号： H01L21/67

CPC分类号： H01L21/67051 ,  B08B5/00 ,  B08B5/02 ,  B08B5/023 ,  H01L21/67028 ,  H01L21/67034

摘要： A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.

摘要翻译： 基板液体处理装置包括：保持和旋转晶片的卡盘（13），向晶片背面排出吹扫气体的后表面清洗喷嘴（15），以及将净化气体排出的周边清洗喷嘴16 到晶片的背面。 后表面清洗喷嘴在平面图中具有从基板的中心侧向周​​边侧延伸的狭缝状的开口部。 狭缝状开口部与被基板保持单元保持的基板之间的垂直距离随着接近基板的中心侧的开口部的端部而增大。 周边清洗喷嘴将清洗气体朝向基板的中心部朝向基板的背面的区域排出，该区域位于背面清洗喷嘴的狭缝状开口部的端部的径向外侧， 径向地位于衬底的周边边缘内。

公开(公告)号：US20150027492A1

公开(公告)日：2015-01-29

申请号：US14321054

申请日：2014-07-01

申请人： TOKYO ELECTRON LIMITED

发明人： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC分类号： B08B1/04 ,  B08B3/04 ,  H01L21/67

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  H01L21/68792

摘要： There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

摘要翻译： 设置有第一和第二清洁部件，其构造成当由吸收垫保持的晶片水平保持时清洁晶片的后表面中的中心区域，并且被配置为清洁晶片的后表面中的周边区域， 晶片由旋转卡盘保持。 由于提供第一和第二清洁部件，与仅使用一个清洁部件的情况相比，可以提高洗涤性。 第一和第二清洁构件被构造成由公共转动轴水平转动。 当清洁晶片后表面中的中心区时，转轴被定位成与晶片重叠。 由于通过使用晶片的移动区域来定位转动轴，所以可以减小装置的尺寸。

公开(公告)号：US20160314958A1

公开(公告)日：2016-10-27

申请号：US15204068

申请日：2016-07-07

申请人： TOKYO ELECTRON LIMITED

发明人： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC分类号： H01L21/02 ,  H01L21/687 ,  B08B5/02 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  H01L21/67 ,  B08B7/00

CPC分类号： H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

摘要： A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

摘要翻译： 公开的用于清洁基板的背面的基板清洁装置包括：第一基板支撑部，其构造成在基板的背面的第一区域处支撑基板，所述背面朝下; 第二基板支撑部，其构造成在所述基板的背面的第二区域处支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，构成为向所述基板的背面供给清洗液; 干燥部，其构造成干燥所述基板的背面的第二区域; 以及清洁部，其构造成当所述基板被所述第一基板支撑部支撑所述基板时，清洁所述基板的背面的第三区域，所述第三区域包括所述第二区域以及所述基板的背面的第四区域， 基板由第二基板支撑部分支撑，除了后表面的第二区域之外的第四区域。

公开(公告)号：US20150133032A1

公开(公告)日：2015-05-14

申请号：US14533133

申请日：2014-11-05

申请人： TOKYO ELECTRON LIMITED

发明人： Akihiro KUBO ,  Masahiro FUKUDA ,  Taro YAMAMOTO ,  Kenji YADA ,  Masashi ENOMOTO ,  Noboru NAKASHIMA

IPC分类号： H01L21/67 ,  B24B37/005 ,  B24B37/34

CPC分类号： B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

摘要： There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

摘要翻译： 公开了一种抛光清洁机构，其构造成与保持在基板保持单元中的基板的后表面接触，用于保持基板的后表面，并且在该基板的后表面上执行抛光处理和清洁处理 基板，包括构造成清洁基板的后表面的清洁构件，被配置为抛光基板的后表面的抛光构件，以及支撑构件，其构造成将抛光构件和清洁构件支撑在面 基板保持在基板保持单元中，其中抛光构件的面向基板的表面和清洁构件的面对基板的表面在相对高度上不同。

公开(公告)号：US20140352736A1

公开(公告)日：2014-12-04

申请号：US14460020

申请日：2014-08-14

申请人： TOKYO ELECTRON LIMITED

发明人： Taro YAMAMOTO ,  Naoto YOSHITAKA ,  Shuichi NISHIKIDO ,  Yoichi TOKUNAGA

IPC分类号： B05D3/10 ,  B05D5/06 ,  B05D3/06

CPC分类号： B05D3/105 ,  B05D3/065 ,  B05D5/06 ,  G03F7/168 ,  H01L21/67046 ,  H01L21/67051

摘要： A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

摘要翻译： 清洁装置包括：第一基板保持部，其构造成保持基板的背面的第一区域，使得顶面保持面朝上; 第二基板保持部构造成保持基板的背面的第二区域，第二区域与第一区域不重叠，并旋转基板; 顶表面清洁喷嘴，其构造成将顶表面清洁流体供应到所述基板的顶表面; 斜面清洁喷嘴，其构造成将倾斜清洁流体供应到所述基板的斜面部分; 清洗液供给部，其构造成将后表面清洗液供给到由所述第一或第二基板保持部保持的基板的背面; 以及清洁部件，其构造成清洁由所述第一或第二基板保持部保持的所述基板的背面。

公开(公告)号：US20140071411A1

公开(公告)日：2014-03-13

申请号：US14022434

申请日：2013-09-10

申请人： Tokyo Electron Limited

发明人： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC分类号： G03F7/30

CPC分类号： G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

摘要： The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

摘要翻译： 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20130194557A1

公开(公告)日：2013-08-01

申请号：US13760399

申请日：2013-02-06

申请人： Tokyo Electron Limited

发明人： Taro YAMAMOTO ,  Kousuke YOSHIHARA ,  Yuichi YOSHIDA

IPC分类号： H01L21/027

CPC分类号： H01L21/027 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

摘要： A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

摘要翻译： 一种显影衬底的方法，包括使衬底旋转并将显影液从显影剂喷嘴的排出口供应到衬底的表面上，同时将位于衬底上方的显影剂喷嘴从中心部分朝向衬底的周边部分移动 并且将第一冲洗液从第一冲洗喷嘴的排出口提供到基板的表面上，同时将设置在基板上方的第一冲洗喷嘴从中心部分朝向基板的周边部分移动。 同时进行显影液和第一漂洗液的供给，第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。