公开(公告)号：US20220037167A1

公开(公告)日：2022-02-03

申请号：US17443358

申请日：2021-07-26

Applicant: Tokyo Electron Limited

Inventor： Takashi YABUTA ,  Hidetoshi NAKAO ,  Masatoshi KASAHARA ,  Daisuke SAIKI

IPC: H01L21/67 ,  B01F3/04 ,  B01F3/22 ,  H01L21/306

Abstract: A substrate processing apparatus includes: at least one processing part for etching a polysilicon film or an amorphous silicon film formed on a substrate using an alkaline chemical liquid; a reservoir configured to recover and store the chemical liquid used in the at least one processing part; processing lines configured to supply the chemical liquid stored in the reservoir to the at least one processing part; a circulation line configured to take out the chemical liquid from the reservoir and to return the same to the reservoir; and a first gas supply line connected to the circulation line and configured to supply an inert gas to the circulation line. The circulation line includes an ejection port configured to eject a mixed fluid of the inert gas supplied by the first gas supply line and the chemical liquid taken out from the reservoir into the chemical liquid stored in the reservoir.

公开(公告)号：US20180254199A1

公开(公告)日：2018-09-06

申请号：US15907394

申请日：2018-02-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki SUZUKI ,  Takashi YABUTA ,  Jun NONAKA

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/306 ,  H01L21/02

Abstract: A substrate processing apparatus includes a holding device that holds a substrate horizontally, a rotation device that rotates the holding device such that the substrate held by the holding device is rotated, a supply device that includes a nozzle and supplies etching liquid from the nozzle to the substrate held by the holding device, a movement device that moves the nozzle with respect to the substrate held by the holding device, and a control device including circuitry that executes a scan process in which the circuitry controls the rotation, movement and supply devices such that while the liquid is supplied from the nozzle to the substrate, the nozzle is moved back and forth over the substrate between first and second positions on outer peripheral side of the substrate relative to the first position. The circuit of the control device executes the scan process multiple times while changing the first position.