公开(公告)号：US20220088713A1

公开(公告)日：2022-03-24

申请号：US17543867

申请日：2021-12-07

Applicant: TOPPAN Inc.

Inventor： Masaaki YOSHINO ,  Tomomi HIRAOKA ,  Sawa MINAMI

IPC: B23K26/351 ,  G02F1/155 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/073

Abstract: A sheet processing method including irradiating a transparent conductive layer covered with a transparent sheet with a pulsed laser beam such that the pulsed laser beam is applied to a portion of the transparent conductive layer through the transparent sheet, and that the portion irradiated has an insulating property. The pulsed laser beam has a top-hat intensity distribution and has a transmittance through the transparent sheet being higher than a transmittance through the transparent conductive layer.