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1.发明申请公开(公告)号：US20180321591A1
公开(公告)日：2018-11-08
申请号：US16033236
申请日：2018-07-12
Inventor： Kenji Hiki , Tomohiro Imoto , Satoshi Takahashi
CPC classification number: G03F7/425 , C08L63/00 , G02B5/20 , G03F7/0007 , G03F7/033 , G03F7/162 , G03F7/168 , G03F7/20 , G03F7/26 , G03F7/42 , G03F7/426 , H01L27/14621 , H01L27/14685
Abstract: A thermosetting coloring composition for manufacturing a color filter for a solid-state imaging element provided with a colored pattern formed by patterning a colored layer by dry etching is provided. The composition contains a pigment (A), a dispersant (B), a thermosetting compound (C), and a solvent (D). A ratio of the pigment (A) to a total solid content of the thermosetting coloring composition is 50 mass percent or more. The dispersant (B) contains a dispersant (b1) having an acidic functional group and/or a dispersant (b2) having a basic functional group. The thermosetting compound (C) contains a glycidyl etherified epoxy compound of sorbitol.
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Patent Agency Ranking
公开(公告)号：US10991736B2
公开(公告)日：2021-04-27
申请号：US15977115
申请日：2018-05-11
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Satoshi Takahashi , Tomohiro Imoto
IPC: H01L27/146 , H01L21/3065 , G02B5/20 , H01L21/311
Abstract: A method of producing a color filter includes applying, on a semiconductor substrate, a first color filter material including a first resin dispersion including a first pigment and a resin material, curing the first color filter material such that a first color filter film is formed and serves as a precursor of a first color filter including the first pigment, forming a photosensitive resin mask material layer on the first color filter film, forming openings by photolithography in portions of the photosensitive resin mask material layer such that second and subsequent color filters including pigments of colors different from the first pigment are to be formed in the openings, and that portions of the first color filter film are exposed by the openings, dry-etching the portions of the first color filter film by using a dry etching gas and the photosensitive resin mask material layer as an etching mask, removing the etching mask such that the first color filter is formed, and forming the second and subsequent color filters.
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公开(公告)号：US10915028B2
公开(公告)日：2021-02-09
申请号：US16033236
申请日：2018-07-12
Inventor： Kenji Hiki , Tomohiro Imoto , Satoshi Takahashi
Abstract: A thermosetting coloring composition for manufacturing a color filter for a solid-state imaging element provided with a colored pattern formed by patterning a colored layer by dry etching is provided. The composition contains a pigment (A), a dispersant (B), a thermosetting compound (C), and a solvent (D). A ratio of the pigment (A) to a total solid content of the thermosetting coloring composition is 50 mass percent or more. The dispersant (B) contains a dispersant (b1) having an acidic functional group and/or a dispersant (b2) having a basic functional group. The thermosetting compound (C) contains a glycidyl therified epoxy compound of sorbitol.
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公开(公告)号：US11205671B2
公开(公告)日：2021-12-21
申请号：US16454157
申请日：2019-06-27
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Tomohiro Imoto , Satoshi Takahashi
IPC: H01L27/146 , G02B5/20 , G02B3/00
Abstract: A solid-state image sensor including a semiconductor substrate having photoelectric conversion elements being two-dimensionally formed therein, and a color filter layer formed on the semiconductor substrate and having color filters of colors being two-dimensionally formed therein in a pattern such that the color filters correspond respectively to the photoelectric conversion elements. The color filter layer satisfies formulas (1) and (2): 200≤A≤700 (1) C≤A+200 (2) where A represents a thickness in nm of a first-color color filter of a first color among the colors, and C represents a thickness in nm of color filters of colors other than the first color.
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公开(公告)号：US10998363B2
公开(公告)日：2021-05-04
申请号：US16655357
申请日：2019-10-17
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Satoshi Takahashi
IPC: H01L27/146 , H01L21/3065
Abstract: A solid-state imaging device including a semiconductor substrate including photoelectric conversion elements, and having color filters of plural colors formed on the semiconductor substrate and positioned in correspondence to the photoelectric conversion elements, a first visible-light transmissive layer formed between the semiconductor substrate and the color filters, and second visible-light transmissive layers each formed between adjacent color filters. The second visible-light transmissive layers include a same material as the first visible-light transmissive layer and are continuous with the first visible-light transmissive layer. The color filters having a largest area among the color filters of the plural colors each have an edge portion being continuous with an edge portion of a corresponding one of the second visible-light transmissive layers, and the color filters having the largest area each have a side wall on which a reaction product layer including a material forming the first visible-light transmissive layer is formed.
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公开(公告)号：US20190319058A1
公开(公告)日：2019-10-17
申请号：US16454157
申请日：2019-06-27
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Tomohiro IMOTO , Satoshi Takahashi
IPC: H01L27/146 , G02B5/20
Abstract: A solid-state image sensor including a semiconductor substrate having photoelectric conversion elements being two-dimensionally formed therein, and a color filter layer formed on the semiconductor substrate and having color filters of colors being two-dimensionally formed therein in a pattern such that the color filters correspond respectively to the photoelectric conversion elements. The color filter layer satisfies formulas (1) and (2): 200≤A≤700 (1) C≤A+200 (2) where A represents a thickness in nm of a first-color color filter of a first color among the colors, and C represents a thickness in nm of color filters of colors other than the first color.
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