公开(公告)号：US11662689B2

公开(公告)日：2023-05-30

申请号：US16938204

申请日：2020-07-24

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Soko Koda ,  Akihito Kagotani ,  Tomoyuki Shirasaki ,  Noriko Harashima

IPC: G03H1/00 ,  G02B5/32 ,  G03H1/02 ,  G03H1/08 ,  G03H1/22

CPC classification number: G03H1/0011 ,  G02B5/32 ,  G03H1/0252 ,  G03H1/08 ,  G03H1/2286 ,  G03H2001/2244 ,  G03H2225/32 ,  G03H2250/42

Abstract: A hologram that includes a formation layer and a reflection layer that are laminated. The formation layer has an optical phase modulation structure on a first interface in contact with the reflection layer. When reference light emitted from a point light source enters through a second interface different from the first interface of the formation layer, the entirety or part of an image to be reconstructed by the optical phase modulation structure is reconstructed as spatial information on the point light source side relative to the second interface.

公开(公告)号：US11303261B2

公开(公告)日：2022-04-12

申请号：US17100101

申请日：2020-11-20

Applicant: TOPPAN PRINTING CO.,LTD.

Inventor： Tomoyuki Shirasaki ,  Hironori Nomura ,  Noriko Kanou ,  Susumu Maniwa ,  Jun Onohara

IPC: H03H7/01 ,  H05K1/16 ,  H03H7/46 ,  H05K3/46

Abstract: A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.