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Patent Agency Ranking
公开(公告)号：US08535979B2
公开(公告)日：2013-09-17
申请号：US13665350
申请日：2012-10-31
Applicant: Toppan Printing Co., Ltd.
Inventor： Junko Toda , Susumu Maniwa , Takehito Tsukamoto
CPC classification number: H01L24/27 , H01L21/4828 , H01L23/3121 , H01L23/49548 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48257 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/32245 , H01L2224/48247 , H01L2924/00012 , H01L2924/20756 , H01L2924/00015 , H01L2924/20753
Abstract: A manufacturing method of a semiconductor element substrate including: forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; forming a second photoresist pattern on the second surface of the metallic plate; forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; forming a plurality of concaved parts on the second surface of the metallic plate; forming a resin layer by injecting a resin to the plurality of concaved parts; and etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.
Abstract translation: 一种半导体元件基板的制造方法，包括：在金属板的第一面上形成第一光致抗蚀剂图案，形成半导体元件安装部，半导体元件电极连接端子，布线，外框部，狭缝 ; 在所述金属板的第二表面上形成第二光致抗蚀剂图案; 通过半蚀刻形成狭缝，以将金属芯片与外框架部分的四个角部连接; 在金属板的第二表面上形成多个凹部; 通过向所述多个凹部注入树脂来形成树脂层; 并且蚀刻金属板的第一表面并形成半导体元件电极连接端子和外框架。
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公开(公告)号：US20130112652A1
公开(公告)日：2013-05-09
申请号：US13665350
申请日：2012-10-31
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Junko TODA , Susumu Maniwa , Takehito Tsukamoto
IPC: H01L23/00
CPC classification number: H01L24/27 , H01L21/4828 , H01L23/3121 , H01L23/49548 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48257 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/32245 , H01L2224/48247 , H01L2924/00012 , H01L2924/20756 , H01L2924/00015 , H01L2924/20753
Abstract: A manufacturing method of a semiconductor element substrate including: forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; forming a second photoresist pattern on the second surface of the metallic plate; forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; forming a plurality of concaved parts on the second surface of the metallic plate; forming a resin layer by injecting a resin to the plurality of concaved parts; and etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.
Abstract translation: 一种半导体元件基板的制造方法，包括：在金属板的第一面上形成第一光致抗蚀剂图案，形成半导体元件安装部，半导体元件电极连接端子，布线，外框部，狭缝 ; 在所述金属板的第二表面上形成第二光致抗蚀剂图案; 通过半蚀刻形成狭缝，以将金属芯片与外框架部分的四个角部连接; 在金属板的第二表面上形成多个凹部; 通过向所述多个凹部注入树脂来形成树脂层; 并且蚀刻金属板的第一表面并形成半导体元件电极连接端子和外框架。
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公开(公告)号：US20140021162A1
公开(公告)日：2014-01-23
申请号：US14038114
申请日：2013-09-26
Applicant: TOPPAN PRINTING CO., LTD.
Inventor： Susumu Maniwa , Takehito Tsukamoto , Junko Toda
IPC: H01L21/48
CPC classification number: H01L21/48 , H01L21/4828 , H01L23/3121 , H01L23/4951 , H01L23/49513 , H01L23/49517 , H01L23/49861 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
Abstract: A manufacturing method of a lead frame substrate includes: applying a photosensitive resist or a dry film to first and second surfaces of a metal plate; pattern-exposing the photosensitive resist or the dry film, and then developing the first surface and the second surface to form on the first surface a first resist pattern for forming a connection post and to form on the second surface a second resist pattern for forming a wiring pattern; etching the first surface partway down the metal plate to form the connection post; filling the first surface with a pre-molding resin to a thickness with which the etched surface is buried; removing the pre-molding resin uniformly in a thickness direction of the pre-molding resin until a bottom surface of the connection post is exposed; and etching the second surface to form a wiring pattern.
Abstract translation: 引线框架基板的制造方法包括：将光敏抗蚀剂或干膜施加到金属板的第一和第二表面; 对感光性抗蚀剂或干膜进行图案曝光，然后显影第一表面和第二表面，以在第一表面上形成用于形成连接柱的第一抗蚀剂图案，并在第二表面上形成第二抗蚀剂图案，用于形成 布线图案 在金属板的中间刻蚀第一表面以形成连接柱; 用预成型树脂填充第一表面至被蚀刻表面被埋入的厚度; 在预成型树脂的厚度方向上均匀地除去预成型树脂，直到连接柱的底面露出为止; 并蚀刻第二表面以形成布线图案。
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公开(公告)号：US11303261B2
公开(公告)日：2022-04-12
申请号：US17100101
申请日：2020-11-20
Applicant: TOPPAN PRINTING CO.,LTD.
Inventor： Tomoyuki Shirasaki , Hironori Nomura , Noriko Kanou , Susumu Maniwa , Jun Onohara
Abstract: A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.
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公开(公告)号：US08703598B2
公开(公告)日：2014-04-22
申请号：US14038114
申请日：2013-09-26
Applicant: Toppan Printing Co., Ltd.
Inventor： Susumu Maniwa , Takehito Tsukamoto , Junko Toda
IPC: H01L21/44
CPC classification number: H01L21/48 , H01L21/4828 , H01L23/3121 , H01L23/4951 , H01L23/49513 , H01L23/49517 , H01L23/49861 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
Abstract: A manufacturing method of a lead frame substrate includes: applying a photosensitive resist or a dry film to first and second surfaces of a metal plate; pattern-exposing the photosensitive resist or the dry film, and then developing the first surface and the second surface to form on the first surface a first resist pattern for forming a connection post and to form on the second surface a second resist pattern for forming a wiring pattern; etching the first surface partway down the metal plate to form the connection post; filling the first surface with a pre-molding resin to a thickness with which the etched surface is buried; removing the pre-molding resin uniformly in a thickness direction of the pre-molding resin until a bottom surface of the connection post is exposed; and etching the second surface to form a wiring pattern.
Abstract translation: 引线框架基板的制造方法包括：将光敏抗蚀剂或干膜施加到金属板的第一和第二表面; 对感光性抗蚀剂或干膜进行图案曝光，然后显影第一表面和第二表面，以在第一表面上形成用于形成连接柱的第一抗蚀剂图案，并在第二表面上形成第二抗蚀剂图案，用于形成 布线图案 在金属板的中间刻蚀第一表面以形成连接柱; 用预成型树脂填充第一表面至被蚀刻表面被埋入的厚度; 在预成型树脂的厚度方向上均匀地除去预成型树脂，直到连接柱的底面露出为止; 并蚀刻第二表面以形成布线图案。
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