Circuit board
    1.
    发明授权

    公开(公告)号:US11303261B2

    公开(公告)日:2022-04-12

    申请号:US17100101

    申请日:2020-11-20

    Abstract: A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.

    Circuit board
    2.
    发明授权

    公开(公告)号:US12177978B2

    公开(公告)日:2024-12-24

    申请号:US17338524

    申请日:2021-06-03

    Inventor: Jun Onohara

    Abstract: A circuit board includes a glass substrate having a first surface and a second surface facing away from the first surface; a first coil wiring pattern formed on the first surface and a second coil wiring pattern formed on the second surface, the first and second coil wiring patterns constituting part of a coil; a through hole extending through a predetermined portion of the glass substrate from an end of the first coil wiring pattern to an end of the second coil wiring pattern; a through hole inner conductive surface formed on the inner side of the through hole, the first and second coil wiring patterns and the through hole inner conductive surface constituting the coil wound around a direction perpendicular to an axis of the through hole and to a direction in which the first and second coil wiring patterns extend.

Patent Agency Ranking