公开(公告)号：US20250079130A1

公开(公告)日：2025-03-06

申请号：US18816038

申请日：2024-08-27

Applicant: TOTO LTD.

Inventor： Ryunosuke NAKAGAWA ,  Tatsuya KOGA

IPC: H01J37/32 ,  C23C24/04

Abstract: A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. A particle 300 that is harder than the protective film 200 is dispersedly arranged inside the protective film 200.

公开(公告)号：US20220341018A1

公开(公告)日：2022-10-27

申请号：US17701831

申请日：2022-03-23

Applicant: TOTO LTD.

Inventor： Ryunosuke NAKAGAWA ,  Tatsuya KOGA

IPC: C23C4/06 ,  C23C4/11 ,  C23C4/12 ,  H01J37/32 ,  H01L21/02

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer located on the base material. The base material includes a first surface, a second surface, and at least one hole extending through the first and second surfaces. The at least one hole includes a first, a second and a third hole part. The first hole part is continuous with the first surface and is oblique. The second hole part is between the second surface and the first hole part. The third hole part is between the first hole part and the second hole part and is oblique. The ceramic layer includes a first part located on the first surface and a second part located on the first hole part.

公开(公告)号：US20220351945A1

公开(公告)日：2022-11-03

申请号：US17701844

申请日：2022-03-23

Applicant: TOTO LTD.

Inventor： Ryunosuke NAKAGAWA ,  Tatsuya KOGA

IPC: H01J37/32 ,  C04B35/117

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a composite structure. The composite structure includes a base material and a ceramic layer. The ceramic layer includes a first part located on a surface of the base material and is exposed. The composite structure includes a through-hole extending through the base material and the ceramic layer. The through-hole extends in a first direction. The through-hole includes a first hole region, a second hole region and a third hole region. The first hole region is continuous with a surface of the first part. The third hole region is positioned between the first hole region and the second hole region in the first direction. A hardness of the third hole region is greater than a hardness of the first hole region.

公开(公告)号：US20220351944A1

公开(公告)日：2022-11-03

申请号：US17701813

申请日：2022-03-23

Applicant: TOTO LTD.

Inventor： Ryunosuke NAKAGAWA ,  Nobutomo OTSUKA ,  Tatsuya KOGA

IPC: H01J37/32

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer. The base material includes a first surface, a second surface at a side opposite to the first surface, and at least one hole extending through the first and second surfaces. The ceramic layer is a ceramic layer located on the base material. The at least one hole includes a first hole part continuous with the first surface. The ceramic layer includes a first part and a second part. The first part is located on the first surface. The first part is exposed. The second part is located on the first hole part. An arithmetical mean height Sa of a surface of the first part is less than an arithmetical mean height Sa of a surface of the second part.

公开(公告)号：US20220344125A1

公开(公告)日：2022-10-27

申请号：US17701855

申请日：2022-03-23

Applicant: TOTO LTD.

Inventor： Ryunosuke NAKAGAWA ,  Tatsuya KOGA

IPC: H01J37/32

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer. The base material includes a first surface, a second surface, and at least one hole. The at least one hole extends through the first and second surfaces. The ceramic layer is located on the first surface. The at least one hole includes an oblique surface and a perpendicular surface. The oblique surface is continuous with the first surface and is oblique to a first direction from the first surface toward the second surface. The perpendicular surface is positioned between the second surface and the oblique surface in the first direction and extends along the first direction. An angle between the first surface and the oblique surface is greater than an angle between the perpendicular surface and the oblique surface.