LAMINATED FILM
    2.
    发明申请

    公开(公告)号:US20230056608A1

    公开(公告)日:2023-02-23

    申请号:US17793316

    申请日:2021-01-05

    申请人: TOYOBO CO., LTD.

    摘要: An object of the present invention is to provide a laminated film that exhibits superior water repellency and oil repellency and has good adhesion between a substrate film and a coating layer, and for this purpose, the laminated film is a laminated film comprising a substrate film and at least one coating layer laminated on the substrate film, wherein the coating layer contains an acid-modified polyolefin and hydrophobic oxide particles, and the acid-modified polyolefin has an acid value of 1 mgKOH/g or more and 60 mgKOH/g or less. Preferably, the laminated film is a solution means in which a surface of the coating layer has a contact angle with respect to water of 100 degrees or more.

    LAMINATED FILM
    3.
    发明申请

    公开(公告)号:US20220162411A1

    公开(公告)日:2022-05-26

    申请号:US17433960

    申请日:2020-02-14

    申请人: TOYOBO CO., LTD.

    摘要: [PROBLEM] To provide a laminated film having a coating layer surface which exhibits superior water-repellent and/or oil-repellent characteristics, [SOLUTION MEANS] A laminated film in which a coating layer is laminated, directly or indirectly by way of another layer, over a substrate film, the laminated film being such that the coating layer is an outermost layer on at least one face of the laminated film, and hydrophobic oxide particles of average primary particle diameter not less than 10 nm but not greater than 300 nm are present in the coating layer in an amount that in terms of solids content is not less than 30 mass % but not greater than 100 mass %.

    METHOD FOR MANUFACTURING DEVICE CONNECTED BODY, AND DEVICE CONNECTED BODY

    公开(公告)号:US20210345484A1

    公开(公告)日:2021-11-04

    申请号:US17285388

    申请日:2019-09-24

    申请人: TOYOBO CO., LTD.

    IPC分类号: H05K1/02 H05K3/00

    摘要: A method for manufacturing a device connected body, including: a step A for readying a first laminate having, in the order listed, an inorganic substrate, a resin layer, and a plurality of devices mounted on the resin layer so that a gap is present therebetween; a step B for forming, on the first laminate, an elastomer layer so as to cover the plurality of devices and the gap portion and obtaining a second laminate; and a step C for peeling the inorganic substrate. The resin layer is either formed as a plurality of resin layers in advance at least at positions corresponding to the plurality of devices, or formed as a plurality of resin layers at least at positions corresponding to the plurality of devices by removing a part of the resin layer after step C for peeling the inorganic substrate.