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公开(公告)号：US20240075718A1
公开(公告)日：2024-03-07
申请号：US18263100
申请日：2022-06-09
申请人： TOYOBO CO., LTD.
CPC分类号： B32B27/08 , B32B3/30 , B32B7/06 , B32B17/10 , B32B27/16 , B32B27/281 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/748
摘要： The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.
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公开(公告)号：US20240116274A1
公开(公告)日：2024-04-11
申请号：US18263953
申请日：2022-02-22
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Satoshi MAEDA , Tetsuo OKUYAMA , Naoki WATANABE
CPC分类号： B32B17/10 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/32 , B32B27/36 , B32B2307/538 , B32B2457/00
摘要： An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 μm.
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公开(公告)号：US20220274314A1
公开(公告)日：2022-09-01
申请号：US17632159
申请日：2020-06-18
申请人： TOYOBO CO., LTD.
发明人： Tetsuo OKUYAMA , Kaya TOKUDA , Kazuyuki OUYA , Naoki WATANABE
摘要： This apparatus for manufacturing a laminate comprises: a first sheet transporting device for transporting a first sheet; a water supply device for supplying an aqueous medium to the surface of the first sheet coated with a silane coupling agent and/or the surface of a second sheet coated with a silane coupling agent; and a laminating device for attaching the first sheet and the second sheet which have been supplied with the aqueous medium.
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4.发明申请公开(公告)号：US20220143964A1
公开(公告)日：2022-05-12
申请号：US17434405
申请日：2020-03-30
申请人： TOYOBO CO., LTD.
发明人： Masahiro YAMASHITA , Kaya TOKUDA , Tetsuo OKUYAMA
IPC分类号： B32B37/00 , B32B37/12 , B32B37/20 , B32B37/06 , B65H23/195
摘要： The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.
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公开(公告)号：US20240227363A1
公开(公告)日：2024-07-11
申请号：US18558962
申请日：2022-07-07
申请人： TOYOBO CO., LTD.
CPC分类号： B32B17/10 , B32B27/281 , B32B27/34 , B32B2250/02 , B32B2255/26 , B32B2307/306 , B32B2307/308 , B32B2307/4026 , B32B2307/412 , B32B2307/54 , B32B2307/542 , B32B2377/00 , B32B2379/08
摘要： Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.
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6.发明公开公开(公告)号：US20230271367A1
公开(公告)日：2023-08-31
申请号：US18005934
申请日：2021-07-30
申请人： TOYOBO CO., LTD.
发明人： Tetsuo OKUYAMA , Kazuyuki OUYA , Kaya TOKUDA
CPC分类号： B29C48/21 , B29C48/022 , B29K2079/08
摘要： Provided is a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, the laminate having stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in the case of a large surface area, and having few blister defects. This laminate has an inorganic substrate, a silane coupling agent layer that includes amino groups, and a heat-resistant polymer film in the stated order, the laminate being characterized in that the elemental nitrogen component ratio in an inorganic-substrate-side peel surface after the heat-resistant polymer film has been peeled from the inorganic substrate at 90° is greater than 3.5 at % and no greater than 11 at %.
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公开(公告)号：US20230150252A1
公开(公告)日：2023-05-18
申请号：US17996745
申请日：2021-06-09
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Tetsuo OKUYAMA , Satoshi MAEDA , Naoki WATANABE , Harumi YONEMUSHI , Denichirou MIZUGUCHI
CPC分类号： B32B37/02 , B32B7/022 , B32B9/045 , B32B27/281 , B32B38/10 , B32B2307/306 , B32B2307/538 , B32B2037/0092
摘要： The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.
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公开(公告)号：US20210308987A1
公开(公告)日：2021-10-07
申请号：US17268947
申请日：2019-08-07
申请人： TOYOBO CO., LTD.
摘要： A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.
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公开(公告)号：US20240227373A1
公开(公告)日：2024-07-11
申请号：US18553972
申请日：2022-07-07
申请人： TOYOBO CO., LTD.
CPC分类号： B32B27/34 , B32B27/281 , B32B2307/306 , B32B2307/54 , B32B2377/00 , B32B2379/08 , B32B2457/08
摘要： The present invention provides a multilayer body of an inorganic substrate and a heat-resistant polymer film, the multilayer body being suppressed in vibrations during handling. A multilayer body of a heat-resistant polymer film and an inorganic substrate according to the present invention does not substantially use an adhesive and is characterized in that: the heat-resistant polymer film is transparent; the tensile elastic modulus E1 (GPa) and the thickness T1 (μm) of the multilayer body satisfy formula (1); and the storage elastic modulus E2 (GPa) at 280° C. and the thickness T1 (μm) of the multilayer body satisfy formula (2). (1): 25,000≤E1×T1 (2): E2×T1≤52,000
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10.发明公开公开(公告)号：US20240059057A1
公开(公告)日：2024-02-22
申请号：US18261394
申请日：2021-10-28
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Tetsuo OKUYAMA , Satoshi MAEDA , Naoki WATANABE , Mayumi AKASHI
CPC分类号： B32B27/36 , B32B7/12 , B32B27/08 , B32B27/281 , B32B43/003 , B32B37/1284 , B32B2250/03 , B32B2250/24 , B32B2305/30 , B32B2367/00 , B32B2379/08 , B32B2307/536
摘要： Provided is a laminated film that includes a heat-resistant polymer film and a first protective film laminated on one of the surfaces of the heat-resistant polymer film, wherein: the first protective film has a first substrate and a first adhesive layer provided on the first substrate; the first substrate, the first adhesive layer, and the heat-resistant polymer film are laminated in this order; the first substrate is a polyester film or a polyolefin film; the first adhesive layer contains a urethane-based resin; and the maximum diameter of a gelled product in the first adhesive layer is equal to or less than 14 μm.
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