公开(公告)号：US20230318415A1

公开(公告)日：2023-10-05

申请号：US18017523

申请日：2021-03-23

Applicant: AISIN CORPORATION ,  TOYOBO MC Corporation

Inventor： Toshiyuki SABURI ,  Naotaka HAYASHI ,  Masahito TANIGAWA ,  Daiki FUNAOKA ,  Tomohito OYAMA ,  Yuichi OZAWA ,  Ryo UETA ,  Yusaku SAKURABA

IPC: H02K15/12 ,  H02K15/03 ,  H02K1/28

CPC classification number: H02K15/12 ,  H02K15/03 ,  H02K1/28

Abstract: This method for manufacturing a rotor core includes an injection step of injecting a molten resin material into a magnet housing portion of a laminated core heated to a third temperature by a preheating step. The injection step is a step of injecting the resin material into the magnet housing portion while releasing to the outside of the magnet housing portion a volatile organic compound volatilized by heating the resin material by bringing the resin material into contact with the laminated core heated to the third temperature.

公开(公告)号：US20240279378A1

公开(公告)日：2024-08-22

申请号：US18565270

申请日：2022-05-26

Applicant: TOYOBO MC Corporation

Inventor： Daiki FUNAOKA

IPC: C08F283/01 ,  C08K3/08 ,  H01F1/053

CPC classification number: C08F283/01 ,  C08K3/08 ,  H01F1/053 ,  C08K2201/01

Abstract: An object of the present invention is to provide a composition including magnetic powder having excellent fluidity and sufficient curing speed, and the present invention is a thermosetting composition including a crystalline radical polymerizable compound having a melting point in the range of 30 to 150° C. and magnetic powder.

公开(公告)号：US20240218132A1

公开(公告)日：2024-07-04

申请号：US18289025

申请日：2021-05-14

Applicant: TOYOBO MC Corporation

Inventor： Masahito TANIGAWA ,  Daiki FUNAOKA ,  Ryo HAMASAKI ,  Masashi FUJII

IPC: C08J5/00 ,  C08K3/36

CPC classification number: C08J5/00 ,  C08K3/36 ,  C08J2333/14 ,  C08J2363/00

Abstract: An object of the present invention is to provide a new method for producing a solid object of a thermally curable composition.
The method for producing a solid object of a thermally curable composition includes:



a first heating step of heating the thermally curable composition at a temperature of a melting onset temperature (° C.) of the thermally curable composition or more and less than a curing onset temperature (° C.) of the thermally curable composition; and
a first cooling step of introducing the thermally curable composition into a mold and cooling the thermally curable composition to a temperature lower than the melting onset temperature (° C.).