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1.发明申请Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatus 审中-公开半导体装置的制造方法，半导体制造装置的自动操作方法和自动操作系统以及CMP装置的自动操作方法公开(公告)号：US20040203321A1
公开(公告)日：2004-10-14
申请号：US10820782
申请日：2004-04-09
IPC分类号： B24B049/12
CPC分类号： B24B37/345 , B24B49/02 , B24B51/00
摘要： In a semiconductor manufacturing process such as the CMP process with the large ratio of manual work, the automation is promoted in order to achieve the rationalization and the manpower reduction, the improvement of the processing ability, the reduction of the investment amount, and the improvement of the indirect operation efficiency. By just downloading the process recipe of the product wafer from the host computer to the CMP apparatus in the CMP process, the dummy wafer is processed under the predetermined process condition before processing the product wafer. In this manner, the unmanned operation can be achieved. In addition, the measurement data of the film thickness measuring device mounted to the unmanned CMP apparatus is transmitted together with such process data as the polishing time from the CMP apparatus to the host computer. By doing so, the recipe condition of the CMP apparatus can be changed based on the latest data, and the process condition of the subsequent process is used in the feedforward manner based on the film thickness measurement data. In this manner, it is possible to eliminate the measurement process in the subsequent process.
摘要翻译： 在手工作业比例大的CMP工艺等半导体制造工艺中，为了实现合理化和人力的降低，加工能力的提高，投入量的减少和改善，实现了自动化 的间接运营效率。 通过在CMP工艺中将主产品晶片的工艺配方下载到CMP装置，在处理产品晶片之前，在预定的工艺条件下处理虚设晶片。 以这种方式，可以实现无人操作。 此外，安装到无人化CMP装置的膜厚测量装置的测量数据与从CMP装置到主计算机的抛光时间的处理数据一起发送。 通过这样做，可以基于最新数据改变CMP装置的配方条件，并且基于膜厚测量数据以前馈方式使用后续处理的处理条件。 以这种方式，可以消除后续处理中的测量过程。
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