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公开(公告)号:US20210280442A1
公开(公告)日:2021-09-09
申请号:US17119106
申请日:2020-12-11
申请人: TSC INC.
发明人: Oh Su KIM , Sun Il PARK
IPC分类号: H01L21/67 , H01L21/677
摘要: Disclosed herein is an apparatus for sensing a wafer loading state using a sound wave sensor, including: a wafer loading part into which a wafer is loaded or unloaded along a slot; a sound wave sensor installed to be spaced apart from the slot, and sensing a contact sonic wave generated due to contact when the wafer is loaded or unloaded to generate real-time waveform information; and a control module confirming whether the wafer is normally loaded into the slot, wherein the control module includes: a control reception part receiving the real-time waveform information; a control memory in which a look-up table including look-up waveform information is stored; and a control determination part determining whether the wafer is normally loaded by comparing the real-time waveform information with the look-up waveform information.
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公开(公告)号:US20200292118A1
公开(公告)日:2020-09-17
申请号:US16793106
申请日:2020-02-18
申请人: TSC INC.
发明人: Oh Su KIM , John Ho KUK
IPC分类号: F16L53/38
摘要: A heater for a pipe, includes a heater body part having a longitudinal cutting line formed in the entire thickness section to form a pair of longitudinal cutting planes in the entire length section, a heating wire installed in the heater body part, and a restraint operating part installed at the heater body part and restraining the pair of longitudinal cutting planes not to be spaced apart from each other. Each of the longitudinal cutting planes includes: a longitudinal outer cutting area disposed in a thickness direction from an outer surface of the heater body part, a longitudinal intermediate cutting area extending from the longitudinal outer cutting area in a circumferential direction of the heater body part, and a longitudinal inner cutting area extending from the longitudinal intermediate cutting area to reach the inner surface of the heater body part in the thickness direction of the heater body part.
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公开(公告)号:US20160146393A1
公开(公告)日:2016-05-26
申请号:US14844734
申请日:2015-09-03
申请人: TSC INC.
发明人: Oh Su KIM , Sun Il PARK
CPC分类号: H05B3/58 , F16L53/38 , F16L59/14 , H05B2203/003
摘要: Disclosed is a pipe heater comprising a tubular heat insulating layer having a pair of separating surfaces formed over the entire length thereof, an external cover bonded to the outer surface of the heat insulating layer to enclose the heat insulating layer, a heating layer provided inside the heat insulating layer and including a heating wire therein, and an internal cover provided inside the heating layer to enclose the heating layer, wherein the heat insulating layer includes a polyimide foam layer formed of polyimide foam, and a protection layer is interposed between the heat insulating layer and the heating wire to prevent bubbles distributed in the polyimide foam layer from dissipating due to heat transferred from the heating wire.
摘要翻译: 本发明公开了一种管式加热器,其特征在于,具有在整个长度上形成有一对分离面的筒状绝热层,与所述隔热层的外表面接合以封闭所述隔热层的外部盖, 绝热层,其中包括加热线,以及设置在所述加热层内部以包围所述加热层的内盖,其中所述绝热层包括由聚酰亚胺泡沫形成的聚酰亚胺泡沫层,并且保护层插入在所述绝热层之间 层和加热丝,以防止分散在聚酰亚胺泡沫层中的气泡由于从加热丝传递的热而散逸。
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公开(公告)号:US20220010909A1
公开(公告)日:2022-01-13
申请号:US17119098
申请日:2020-12-11
申请人: TSC INC.
发明人: Oh Su KIM , John Ho KUK
IPC分类号: F16L53/38
摘要: A heater system for a pipe for controlling a temperature of a heater installed to surround a pipe and performing a heating or insulation function.
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公开(公告)号:US20200174454A1
公开(公告)日:2020-06-04
申请号:US16699271
申请日:2019-11-29
申请人: TSC INC.
发明人: Oh Su KIM , Byeong-Ho KWON , Sun IL PARK , John Ho KUK , Sun Tai PARK , Dae Kuk KIM
IPC分类号: G05B19/418 , G06F13/40
摘要: Disclosed herein is an identifier based communication system including: a common communication path; a center station having a center station communication module and a center station controller connected to the center station communication module and connected to the common communication path through the center station communication module; and a plurality of distribution stations each including a distribution station communication module connected to the common communication path, a distribution station controller connected to the distribution station communication module, and a distribution station memory connected to the distribution station controller and storing a determined identifier value of the distribution station, wherein the center station controller transmits an identifier setting mode command including a center transmission preliminary identifier value to the distribution stations following an identifier setting request input from the outside; each of the distribution stations includes a distribution station display displaying information on the identifier value and an identifier selection key operated to select the preliminary identifier value displayed on the distribution station display as the determined identifier value of the distribution station; and wherein in a state where either a next preliminary identifier value of the setting mode or the center transmission preliminary identifier value is displayed on a corresponding distribution station display of each distribution, when a corresponding identifier selection key of each distribution station is operated to be on, the distribution station controller stores the preliminary identifier value displayed on the corresponding distribution station display in a corresponding distribution station memory of the distribution station as a determined identifier value of the setting mode of the distribution station, the distribution station controller displays the corresponding determined identifier of the setting mode on the corresponding distribution station display in a form different from the preliminary identifier value of the setting mode, the distribution station controller stores the corresponding determined identifier of the setting mode in the corresponding distribution station memory, and then transmits to other distribution station, a next preliminary identifier value of the setting mode, which is a value increased by the number N (positive integer) from the corresponding determined identifier value of the setting mode, the distribution station controller displays the center transmission preliminary identifier value received from the center station on the corresponding distribution station display after receiving the identifier setting mode command from the center station and until the distribution station controller receives the next preliminary identifier value of the setting mode from the other distribution station, and the distribution station controller sequentially displays the next preliminary identifier value of the setting mode received from the other distribution station on the corresponding distribution station display before the corresponding determined identifier of the setting mode is stored in the corresponding distribution station memory. In this manner, the identifier (ID) based communication system in the disclosure allows the user to easily select the determined identifier value of the distribution station as needed, has a simple configuration of the common communication path, and allows the user to easily visually confirm the determined identifier value of each distribution station.
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公开(公告)号:US20170232574A1
公开(公告)日:2017-08-17
申请号:US15373053
申请日:2016-12-08
申请人: TSC Inc.
发明人: Oh Su KIM , Byung Ho KWON
IPC分类号: B24B37/20 , B24B53/095
CPC分类号: B24B37/20 , B24B53/095
摘要: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.
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