公开(公告)号：US20170272081A1

公开(公告)日：2017-09-21

申请号：US15342554

申请日：2016-11-03

Applicant: TXC CORPORATION

Inventor： CHIEN-WEI CHIANG ,  WAN-LIN HSIEH ,  CHIA-WEI CHEN ,  CHE-LUNG HSU ,  SHENG-HSIANG KAO ,  CHEN-YA WENG ,  CHIA-CHEN CHEN

IPC: H03L1/02 ,  H01L23/498 ,  G01K13/00 ,  H05K1/02 ,  H03L1/04 ,  H01L23/34 ,  H05K1/18

CPC classification number: H03L1/028 ,  G01K13/00 ,  H03L1/02 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/184 ,  H05K2201/10075 ,  H05K2201/10151

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

公开(公告)号：US20190222214A1

公开(公告)日：2019-07-18

申请号：US16363055

申请日：2019-03-25

Applicant: TXC CORPORATION

Inventor： CHIEN-WEI CHIANG ,  WAN-LIN HSIEH ,  CHIA-WEI CHEN ,  CHE-LUNG HSU ,  SHENG-HSIANG KAO ,  CHEN-YA WENG ,  CHIA-CHEN CHEN

IPC: H03L1/02 ,  H05K1/18 ,  H03L1/04 ,  G01K13/00 ,  H05K1/02 ,  H01L23/34

CPC classification number: H03L1/028 ,  G01K13/00 ,  H01L23/345 ,  H03L1/02 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/10075 ,  H05K2201/10151

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.