Abstract:
Array connector includes a connector body having a mating side. The connector body includes a plurality of substrate layers that are stacked side-by-side and have respective mating edges that form the mating side. The substrate layers form a plurality of interfaces in which each interface is defined between adjacent substrate layers. The adjacent substrate layers of each interface are shaped to form a plurality of channels. The array connector also includes communication lines that are disposed within corresponding channels of the connector body such that the communication lines extend along the interfaces. The communication lines are at least one of wire conductors or optical fibers. The communication lines have respective mating terminals that are positioned proximate to the mating side and form a terminal array.
Abstract:
Probe assembly includes a modular device configured to detect external signals or emit energy. The modular device has a device array that includes at least one of electrical contacts or optical fiber ends. The probe assembly also includes a cable assembly that is configured to communicatively couple the modular device to a computing system and transmit data signals therethrough. The cable assembly includes an array connector having a connector body that includes a mating side and channels extending through the mating side and the connector body. The cable assembly includes a plurality of communication lines that are disposed within corresponding channels of the connector body. The communication lines have respective end faces that are positioned proximate to the mating side to form a terminal array. The terminal array is aligned with and coupled to the device array of the modular device.