公开(公告)号：US20170054243A1

公开(公告)日：2017-02-23

申请号：US14832481

申请日：2015-08-21

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Robert Paul Nichols ,  Kevin Edward Weidner ,  David Patrick Orris ,  Julia Lachman

IPC: H01R13/42 ,  H01R12/70

CPC classification number: H01R12/7088 ,  H01C7/021 ,  H01R13/113 ,  H01R13/71 ,  H01R13/7137

Abstract: An electrical power contact includes a mating segment having a mating interface at which the electrical power contact is configured to mate with a mating contact. The mating segment includes an electrically conductive base layer, and an electrically conductive outer layer that includes the mating interface. The mating segment also includes a circuit protection layer that extends between the base layer and the outer layer. The circuit protection layer provides an electrical pathway between the base layer and the outer layer. The circuit protection layer includes a selectively conductive material that is configured to open the electrical pathway between the base layer and the outer layer when an electrical current above a predetermined threshold is passed through the circuit protection layer.

Abstract translation: 电功率触点包括具有配合接口的配合部分，电配接触构造成配合接口被配置成与配合触头配合。 配合段包括导电基底层和包括配合界面的导电外层。 配合段还包括在基层和外层之间延伸的电路保护层。 电路保护层在基层和外层之间提供电路径。 电路保护层包括选择性导电材料，其被配置为当高于预定阈值的电流通过电路保护层时，打开基层和外层之间的电路径。

公开(公告)号：US09972927B2

公开(公告)日：2018-05-15

申请号：US14832481

申请日：2015-08-21

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Robert Paul Nichols ,  Kevin Edward Weidner ,  David Patrick Orris ,  Julia Lachman

IPC: H01R13/71 ,  H01R12/70 ,  H01R13/713 ,  H01C7/02 ,  H01R13/11

CPC classification number: H01R12/7088 ,  H01C7/021 ,  H01R13/113 ,  H01R13/71 ,  H01R13/7137

Abstract: An electrical power contact includes a mating segment having a mating interface at which the electrical power contact is configured to mate with a mating contact. The mating segment includes an electrically conductive base layer, and an electrically conductive outer layer that includes the mating interface. The mating segment also includes a circuit protection layer that extends between the base layer and the outer layer. The circuit protection layer provides an electrical pathway between the base layer and the outer layer. The circuit protection layer includes a selectively conductive material that is configured to open the electrical pathway between the base layer and the outer layer when an electrical current above a predetermined threshold is passed through the circuit protection layer.