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公开(公告)号：US4503597A
公开(公告)日：1985-03-12
申请号：US464379
申请日：1983-02-07
申请人： Tadao Kushima , Masahiro Gooda , Tasao Soga , Toshitaka Yamamoto
发明人： Tadao Kushima , Masahiro Gooda , Tasao Soga , Toshitaka Yamamoto
IPC分类号： H01L21/60 , H01L23/485 , H01L21/00
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2924/0001 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01061 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/12043
摘要： A method of forming a number of discrete solder layers on a semiconductor wafer of a large area. A number of regions which are easy to be wetted with solder are formed on one of the major surfaces of the wafer. A solder foil is positioned on the one major surface and a plate-like jig including a plate and projections formed on one surface thereof is disposed on the solder foil with the projections facing the latter. By heating the stacked assembly at a sufficiently high temperature for the solder foil to be molten, a number of the discrete solder layers having a uniform thickness are formed on the semiconductor wafer.
摘要翻译： 在大面积的半导体晶片上形成多个分立焊料层的方法。 在晶片的一个主表面上形成许多容易被焊料润湿的区域。 焊锡箔位于一个主表面上，并且包括在其一个表面上形成的板和突起的板状夹具设置在焊料箔上，其中突起面向其上。 通过在足够高的温度下加热堆叠的组件以使焊料箔熔融，在半导体晶片上形成多个具有均匀厚度的分立焊料层。
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公开(公告)号：US4491562A
公开(公告)日：1985-01-01
申请号：US501995
申请日：1983-06-07
CPC分类号： B23K35/268 , C22C30/04
摘要： This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.
摘要翻译： 本发明提供耐热疲劳低熔点焊料合金，由13〜20重量％的Bi，42〜50重量％的Pb，余量为Sn组成。 该焊料合金适用于印刷基板或混合基板上或印刷电路板上的搭接接头。
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