Dielectric body and method for production thereof
    1.
    发明授权
    Dielectric body and method for production thereof 有权
    介电体及其制造方法

    公开(公告)号:US07977419B2

    公开(公告)日:2011-07-12

    申请号:US12570754

    申请日:2009-09-30

    IPC分类号: C08K3/10

    摘要: A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of ceramic fillers having different x values in the following Reaction Scheme 1. In this way, a dielectric body having a stable dielectric constant as well as a high dielectric constant against the change in temperature can be manufactured. Ba1-xSrxTiO3  [Reaction Scheme 1] whereas 0

    摘要翻译: 公开了介电体及其制造方法。 根据本发明的实施方案,使用聚合物基质并在下列反应流程图1中表示的电介质体包括在以下反应方案1中具有不同x值的两种或更多种陶瓷填料。以这种方式, 可以制造具有稳定介电常数以及抵抗温度变化的高介电常数的介电体。 Ba1-xSrxTiO3 [反应方案1],而0

    DIELECTRIC BODY AND METHOD FOR PRODUCTION THEREOF
    2.
    发明申请
    DIELECTRIC BODY AND METHOD FOR PRODUCTION THEREOF 有权
    介电体及其生产方法

    公开(公告)号:US20100271749A1

    公开(公告)日:2010-10-28

    申请号:US12570754

    申请日:2009-09-30

    IPC分类号: H01G4/00 C04B35/00

    摘要: A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of ceramic fillers having different x values in the following Reaction Scheme 1. In this way, a dielectric body having a stable dielectric constant as well as a high dielectric constant against the change in temperature can be manufactured. Ba1-xSrxTiO3  [Reaction Scheme 1] whereas 0≦x≦1.

    摘要翻译: 公开了介电体及其制造方法。 根据本发明的实施方案,使用聚合物基质并在下列反应流程图1中表示的电介质体包括在以下反应方案1中具有不同x值的两种或更多种陶瓷填料。以这种方式, 可以制造具有稳定介电常数以及抵抗温度变化的高介电常数的介电体。 Ba1-xSrxTiO3 [反应方案1],而0≦̸ x< 1;

    Electromagnetic shielding material having carbon nanotube and metal as eletrical conductor
    3.
    发明申请
    Electromagnetic shielding material having carbon nanotube and metal as eletrical conductor 有权
    具有碳纳米管和金属作为电导体的电磁屏蔽材料

    公开(公告)号:US20070018142A1

    公开(公告)日:2007-01-25

    申请号:US10575343

    申请日:2004-10-15

    IPC分类号: H01B1/24

    摘要: Disclosed is an electromagnetic shielding material with enhanced shielding effectiveness and mechanical property by employing a carbon nanotube and a metal as an electrical conductor. The electromagnetic shielding material includes a polymer resin for a matrix and two conductive fillers having a carbon nanotube and a metal, wherein a volume percent of the carbon nanotube ranges about 0.2% to about 10% and a volume percent of the metal powder ranges about 7.0% to about 30% so that the total volume percent of the conductive filler is in a range of about 7.2% to about 40%.

    摘要翻译: 公开了一种通过使用碳纳米管和金属作为电导体而具有增强的屏蔽效能和机械性能的电磁屏蔽材料。 电磁屏蔽材料包括用于基体的聚合物树脂和具有碳纳米管和金属的两个导电填料,其中碳纳米管的体积百分比为约0.2%至约10%,金属粉末的体积百分比为约7.0 %至约30%,使得导电填料的总体积百分比在约7.2%至约40%的范围内。

    Electromagnetic shielding material having carbon nanotube and metal as electrical conductor
    4.
    发明授权
    Electromagnetic shielding material having carbon nanotube and metal as electrical conductor 有权
    具有碳纳米管和金属作为电导体的电磁屏蔽材料

    公开(公告)号:US07588700B2

    公开(公告)日:2009-09-15

    申请号:US10575343

    申请日:2004-10-15

    IPC分类号: H01B1/24

    摘要: Disclosed is an electromagnetic shielding material with enhanced shielding effectiveness and mechanical property by employing a carbon nanotube and a metal as an electrical conductor. The electromagnetic shielding material includes a polymer resin for a matrix and two conductive fillers having a carbon nanotube and a metal, wherein a volume percent of the carbon nanotube ranges about 0.2% to about 10% and a volume percent of the metal powder ranges about 7.0% to about 30% so that the total volume percent of the conductive filler is in a range of about 7.2% to about 40%.

    摘要翻译: 公开了一种通过使用碳纳米管和金属作为电导体而具有增强的屏蔽效能和机械性能的电磁屏蔽材料。 电磁屏蔽材料包括用于基体的聚合物树脂和具有碳纳米管和金属的两个导电填料,其中碳纳米管的体积百分比为约0.2%至约10%,金属粉末的体积百分比为约7.0 %至约30%,使得导电填料的总体积百分比在约7.2%至约40%的范围内。