公开(公告)号：US07781885B2

公开(公告)日：2010-08-24

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01L23/10 ,  H01L21/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

公开(公告)号：US20090052483A1

公开(公告)日：2009-02-26

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei LIN ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei LIN ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01S5/024 ,  H01L33/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。