公开(公告)号：US08363398B2

公开(公告)日：2013-01-29

申请号：US12910852

申请日：2010-10-24

申请人： Zeu-Chia Tan

发明人： Zeu-Chia Tan

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer.

摘要翻译： 一种电子设备，包括壳体，容纳在壳体中的电子部件; 以及在壳体和电子部件之间的复合导热层。 复合导热层包括在电子部件和石墨层之间的石墨层和散热垫层。 散热垫层附着在电子部件上。 石墨层附着在壳体的内表面上。 石墨层位于壳体和热垫层之间。 石墨层沿着水平方向的导热效率超过其垂直厚度方向的导热效率。 石墨层的表面积不小于电子部件的表面积。 由电子部件产生的热量被均匀地转移，并通过复合导热层的石墨层扩散到壳体。

公开(公告)号：US20130014532A1

公开(公告)日：2013-01-17

申请号：US13222818

申请日：2011-08-31

申请人： ZEU-CHIA TAN ,  TAI-WEI LIN

发明人： ZEU-CHIA TAN ,  TAI-WEI LIN

IPC分类号： F25D31/00

CPC分类号： F25B49/027 ,  F25B2339/047

摘要： A cooling system includes an area heat extraction hardware, a cooling device including an evaporator, a compressor and a condenser, a grounded-coupled heat exchanger connecting to the condenser and a cooling medium circularly flowing in the area heat extraction hardware, the cooling device and the grounded-coupled heat exchanger. The area heat extraction hardware extracts heat from the air and heats the cooling medium. The heated cooling medium passes through the evaporator and the evaporator extracts the heat of the heated cooling medium. The compressor transfers the heat extracted by the evaporator to the condenser. The condenser transfers the heat from the compressor to the grounded-coupled heat exchanger. The grounded-coupled heat exchanger transfers the heat of the cooling medium to the ground so the cooling medium is cooled.

摘要翻译： 一种冷却系统，包括区域散热硬件，包括蒸发器的冷却装置，压缩机和冷凝器，连接到冷凝器的接地耦合热交换器和在区域散热硬件中循环流动的冷却介质，冷却装置和 接地耦合热交换器。 区域热提取硬件从空气中提取热量并加热冷却介质。 加热的冷却介质通过蒸发器并且蒸发器提取加热的冷却介质的热量。 压缩机将由蒸发器提取的热量传递到冷凝器。 冷凝器将热量从压缩机传递到接地耦合的热交换器。 接地的热交换器将冷却介质的热量传递到地面，以使冷却介质被冷却。

公开(公告)号：US08238105B2

公开(公告)日：2012-08-07

申请号：US12849936

申请日：2010-08-04

申请人： Zhi-Bin Guan ,  Yao-Ting Chang ,  Zeu-Chia Tan

发明人： Zhi-Bin Guan ,  Yao-Ting Chang ,  Zeu-Chia Tan

IPC分类号： H05K7/20

CPC分类号： H05K7/20509

摘要： An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.

摘要翻译： 电子设备包括底盘，安装在底盘中的电路板，耦合到电路板的存储卡和用于冷却存储卡的散热器。 散热器包括第一冷却板，第二冷却板和连接在第一冷却板和第二冷却板的相应侧之间的连接件。 导电构件从连接构件延伸并接触底盘。

公开(公告)号：US20120069510A1

公开(公告)日：2012-03-22

申请号：US12916613

申请日：2010-10-31

申请人： ZEU-CHIA TAN

发明人： ZEU-CHIA TAN

IPC分类号： G06F1/16

CPC分类号： G06F1/184 ,  G06F1/185

摘要： A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board.

摘要翻译： 主板包括主电路板，CPU插座和接口。 主电路板包括保持表面和连接到保持表面的侧壁。 CPU插座位于保持表面上。 界面位于侧壁上。 接口电连接到CPU插座。 该接口提供主电路板和子电路板之间的连接。

公开(公告)号：US20110305559A1

公开(公告)日：2011-12-15

申请号：US12875092

申请日：2010-09-02

申请人： ZEU-CHIA TAN

发明人： ZEU-CHIA TAN

IPC分类号： F04D29/58 ,  F04D29/44

CPC分类号： F04D29/582

摘要： An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. The centrifugal fan includes a fan frame and an impeller mounted in the fan frame. The fan frame includes a base plate, a cover plate and a side wall extending between the base plate and the cover plate. An air outlet is defined in the side wall.The fin assembly is arranged at the air outlet. The cover plate defines an air inlet corresponding to the impeller and forms an air blocking portion near the air outlet. The air blocking portion defines a space therein. A total cross-sectional area of the space of the air blocking portion increases from an inner side of the air blocking portion near the impeller to an outer side of the air blocking portion near the fin assembly, so that the airflow generated by the impeller can be prevented from reflowing back to the impeller from the fin assembly.

摘要翻译： 示例性的散热装置包括离心风扇和翅片组件。 离心风扇包括风扇框架和安装在风扇框架中的叶轮。 风扇框架包括基板，盖板和在基板和盖板之间延伸的侧壁。 在侧壁中限定出气口。 翅片组件布置在出气口处。 盖板限定对应于叶轮的空气入口，并在空气出口附近形成空气阻塞部分。 空气阻挡部分在其中限定空间。 空气阻塞部分的空间的总横截面积从叶轮附近的空气阻塞部分的内侧增加到靠近翅片组件的空气阻塞部分的外侧，使得由叶轮产生的气流 防止从翅片组件回流到叶轮。

公开(公告)号：US20110299252A1

公开(公告)日：2011-12-08

申请号：US12882217

申请日：2010-09-15

申请人： ZEU-CHIA TAN

发明人： ZEU-CHIA TAN

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： An expansion card assembly includes an expansion card and a heat sink. The expansion card includes a board and an electronic component mounted on the board. The board has a component side on which the electronic component is mounted and an opposite solder side. The heat sink includes a U-shaped base. The base includes a heat absorbing plate, an opposite heat dissipation plate and a middle connecting plate. An end of the board adjacent to the electronic component is received in a receiving space of the base defined between the heat absorbing plate and the heat dissipation plate. The heat absorbing plate and the heat dissipation plate of the base are respectively located the component side and the solder side of the board to sandwich the end of the board therebetween. The heat absorbing plate is attached to the electronic component.

摘要翻译： 扩展卡组件包括扩展卡和散热器。 扩展卡包括板和安装在板上的电子部件。 电路板具有安装电子部件的部件侧和相反的焊接面。 散热器包括U形底座。 基座包括吸热板，相对的散热板和中间连接板。 靠近电子部件的板的端部被容纳在限定在吸热板和散热板之间的基座的接收空间中。 基座的吸热板和散热板分别位于板的部件侧和焊料侧，以将板的端部夹在其间。 吸热板附着在电子部件上。

公开(公告)号：US20110292610A1

公开(公告)日：2011-12-01

申请号：US12832946

申请日：2010-07-08

申请人： ZEU-CHIA TAN

发明人： ZEU-CHIA TAN

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of the extending member.

摘要翻译： 散热器包括底板，多个翅片，延伸构件和导热构件。 多个翅片固定在底板上。 延伸构件从底板的端部向外延伸。 导热构件从延伸构件的端部延伸。

公开(公告)号：US20110292608A1

公开(公告)日：2011-12-01

申请号：US12824511

申请日：2010-06-28

申请人： ZEU-CHIA TAN

发明人： ZEU-CHIA TAN

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/36 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.

摘要翻译： 示例性散热装置包括适于分别热连接到第一和第二电子部件的第一和第二散热器; 以及将第一散热器与第二散热器热连接的热管。

公开(公告)号：US07781885B2

公开(公告)日：2010-08-24

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01L23/10 ,  H01L21/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

公开(公告)号：US08562291B2

公开(公告)日：2013-10-22

申请号：US12875092

申请日：2010-09-02

申请人： Zeu-Chia Tan

发明人： Zeu-Chia Tan

IPC分类号： F04D29/42

CPC分类号： F04D29/582

摘要： An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. The centrifugal fan includes a fan frame and an impeller mounted in the fan frame. The fan frame includes a base plate, a cover plate and a side wall extending between the base plate and the cover plate. An air outlet is defined in the side wall. The fin assembly is arranged at the air outlet. The cover plate defines an air inlet corresponding to the impeller and forms an air blocking portion near the air outlet. The air blocking portion defines a space therein. A total cross-sectional area of the space of the air blocking portion increases from an inner side of the air blocking portion near the impeller to an outer side of the air blocking portion near the fin assembly, so that the airflow generated by the impeller can be prevented from reflowing back to the impeller from the fin assembly.

摘要翻译： 示例性的散热装置包括离心风扇和翅片组件。 离心风扇包括风扇框架和安装在风扇框架中的叶轮。 风扇框架包括基板，盖板和在基板和盖板之间延伸的侧壁。 在侧壁中限定出气口。 翅片组件布置在出气口处。 盖板限定对应于叶轮的空气入口，并在空气出口附近形成空气阻塞部分。 空气阻挡部分在其中限定空间。 空气阻塞部分的空间的总横截面积从叶轮附近的空气阻塞部分的内侧增加到靠近翅片组件的空气阻塞部分的外侧，使得由叶轮产生的气流 防止从翅片组件回流到叶轮。