LASER LEVEL
    4.
    发明申请
    LASER LEVEL 审中-公开

    公开(公告)号:US20190011258A1

    公开(公告)日:2019-01-10

    申请号:US16029349

    申请日:2018-07-06

    IPC分类号: G01C15/00 G02B27/30 H01S5/022

    摘要: A laser level comprising a first laser module and a second laser module, each comprising a laser diode and an optical unit, a holder arranging the first laser module and the second laser module in a fixed relative position, and a housing, in which the holder is suspended with a gimbal or ball joint. Each optical unit comprises a collimating lens arranged along the beam path following the laser diode, and configured for collimating a beam emitted by the laser diode; a pair of partially transmitting mirrors, each arranged along the beam path following the collimating lens, and configured for laterally reflecting less than half of the collimated beam in terms of the beam cross-section, and in terms of the beam intensity; and a cylindrical lens arranged along the beam path following the pair of partially transmitting mirrors, and configured for shaping the collimated beam into a fan beam.

    LASER LIGHT SOURCE DEVICE AND METHOD OF MANUFACTURING LASER LIGHT SOURCE DEVICE

    公开(公告)号:US20180331495A1

    公开(公告)日:2018-11-15

    申请号:US15776549

    申请日:2016-02-22

    IPC分类号: H01S5/022

    摘要: A technology disclosed in the specification of the subject application relates to a laser light source device capable of suppressing loss of optical output power from a semiconductor laser device, and to a method of manufacturing of a laser light source device while the degree of freedom in arrangement of the semiconductor laser device is secured. A laser light source device according to the subject technology includes a semiconductor laser device, and an optical element provided on an optical axis of an emission light emitted from the semiconductor laser device. The optical element separates a portion of a luminous flux of an emission light that is emitted from the semiconductor laser device and that is not separated in a fast axis direction from another portion so as to be separated in the fast axis direction.

    Sealed laser diode heat sink module

    公开(公告)号:US10003171B1

    公开(公告)日:2018-06-19

    申请号:US15711350

    申请日:2017-09-21

    摘要: A sealable laser diode heat sink module for a laser diode includes an anode assembly and a cathode assembly having a cathode base and a cathode connector plate. The anode assembly includes an anode base configured to house the laser diode and the cathode base within a sealable cavity recessed into the anode base. The anode base has a cathode base opening configured to receive the cathode connector plate. An anode connector plate extends from the anode base. An anode current path passes through the laser diode and the anode connector plate via direct connections through the anode base. A cathode current path passes through the cathode connector plate passes via direct connections through the cathode base. The anode base is configured to dissipate heat from the laser diode.