摘要:
An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
摘要:
A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.
摘要:
A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.
摘要:
An illumination module including a first light-emitting element, a first heat dissipation element, a first heat conducting unit, a second light-emitting element, a second heat dissipation element, and a second heat conducting unit is provided. The first light-emitting element is capable of emitting a first color light beam. The first heat conducting unit is connected between the first light-emitting element and the first heat dissipation element. The second light-emitting element is capable of emitting a second color light beam. The second heat conducting unit is connected between the second light-emitting element and the second heat dissipation element. The first heat dissipation element and the second heat dissipation element are disposed separately. The first heat conducting unit and the second heat conducting unit are also disposed separately. The heat dissipation characteristic of the illumination module is better. A projection apparatus having the illumination module is also provided.
摘要:
An illumination module including a first light-emitting element, a first heat dissipation element, a first heat conducting unit, a second light-emitting element, a second heat dissipation element, and a second heat conducting unit is provided. The first light-emitting element is capable of emitting a first color light beam. The first heat conducting unit is connected between the first light-emitting element and the first heat dissipation element. The second light-emitting element is capable of emitting a second color light beam. The second heat conducting unit is connected between the second light-emitting element and the second heat dissipation element. The first heat dissipation element and the second heat dissipation element are disposed separately. The first heat conducting unit and the second heat conducting unit are also disposed separately. The heat dissipation characteristic of the illumination module is better. A projection apparatus having the illumination module is also provided.
摘要:
A entertainment robot includes a recognition unit, an environment detecting unit, an intelligent unit, and a behavior unit. The recognition unit receives an input signal from a user and outputs a corresponding command signal. The environment detecting unit detects background information and outputs a corresponding environment signal. The intelligent unit outputs a corresponding behavior signal based on the command signal and the environment signal. The behavior unit controls the operation of the entertainment robot based on the behavior signal.
摘要:
A container data center system includes a container, a plurality of servers, at least a regulation device, a first refrigeration device and a second refrigeration device. The container defines a first receiving room and a second receiving room isolated from the first receiving room. The servers are received in the first receiving room. The at least a regulation device is received in second receiving room. The at least regulation device is electrically connected to the servers for regulating the servers. The first refrigeration device is installed outside the container for cooling the first receiving room. The second refrigeration device is installed outside the container for cooling the second receiving room.
摘要:
A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.
摘要:
A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.
摘要:
A heat dissipation apparatus includes a shaped and resilient connecting plate, and a first heat-dissipating plate and a second heat-dissipating plate clamping down on a storage device to dissipate heat.