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    Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine
    4.
    发明授权
    Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine 有权
    热障涂层，其制造方法，涡轮机部件和燃气轮机

    公开(公告)号：US07354663B2

    公开(公告)日：2008-04-08

    申请号：US10815734

    申请日：2004-04-02

    申请人： Taiji Torigoe ,  Kazutaka Mori ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara

    发明人： Taiji Torigoe ,  Kazutaka Mori ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara

    IPC分类号： B32B9/00

    CPC分类号： C23C4/11 ,  B32B15/04 ,  C23C28/3215 ,  C23C28/3455 ,  F05B2230/90 ,  F05C2253/12 ,  Y02T50/67 ,  Y10T428/12618

    摘要： A thermal barrier coating enabling to prevent peeling of layer in a high temperature use and still having a high thermal barrier effect, a turbine part coated by this thermal barrier coating and a gas turbine comprising this turbine part are provided. The thermal barrier coating comprises a base material 21 of high temperature heat resistant alloy and a ceramics layer 23 formed on the base material 21. The ceramics layer 23 comprises ZrO2 added with Yb2O3 as stabilizer and is laminated on the base material via a bond coat layer 22 laminated as a metallic bond layer. A plurality of cracks 23A are preferably introduced in the ceramics layer 23. The turbine part is constructed having its surface coated with the above thermal barrier coating.

    摘要翻译： 提供能够防止在高温使用中并且仍然具有高热障效应的层的剥离的热障涂层，由该热障涂层涂覆的涡轮部分和包括该涡轮部的燃气轮机。 隔热涂层包括高温耐热合金的基材21和形成在基材21上的陶瓷层23。 陶瓷层23由添加了Yb 2 O 3 O 3的稳定剂构成的ZrO 2 2层叠在基材上，层叠有粘接层22 作为金属结合层。 在陶瓷层23中优选引入多个裂纹23A。 涡轮机部件被构造成具有涂覆有上述热障涂层的表面。

    Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine
    5.
    发明申请
    Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine 有权
    热障涂层，其制造方法，涡轮机部件和燃气轮机

    公开(公告)号：US20050221109A1

    公开(公告)日：2005-10-06

    申请号：US10815734

    申请日：2004-04-02

    申请人： Taiji Torigoe ,  Kazutaka Mori ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara

    发明人： Taiji Torigoe ,  Kazutaka Mori ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara

    IPC分类号： B32B15/04 ,  C23C4/10 ,  C23C28/00

    CPC分类号： C23C4/11 ,  B32B15/04 ,  C23C28/3215 ,  C23C28/3455 ,  F05B2230/90 ,  F05C2253/12 ,  Y02T50/67 ,  Y10T428/12618

    摘要： A thermal barrier coating enabling to prevent peeling of layer in a high temperature use and still having a high thermal barrier effect, a turbine part coated by this thermal barrier coating and a gas turbine comprising this turbine part are provided. The thermal barrier coating comprises a base material 21 of high temperature heat resistant alloy and a ceramics layer 23 formed on the base material 21. The ceramics layer 23 comprises ZrO2 added with Yb2O3 as stabilizer and is laminated on the base material via a bond coat layer 22 laminated as a metallic bond layer. A plurality of cracks 23A are preferably introduced in the ceramics layer 23. The turbine part is constructed having its surface coated with the above thermal barrier coating.

    摘要翻译： 提供能够防止在高温使用中并且仍然具有高热障效应的层的剥离的热障涂层，由该热障涂层涂覆的涡轮部分和包括该涡轮部的燃气轮机。 隔热涂层包括高温耐热合金的基材21和形成在基材21上的陶瓷层23。 陶瓷层23包含添加有Yb 2 O 3 O 3的稳定剂的ZrO 2，并且通过层压的粘合涂层22层压在基材上 作为金属结合层。 在陶瓷层23中优选引入多个裂纹23A。 涡轮机部件被构造成具有涂覆有上述热障涂层的表面。

    IC CARD AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE PACKAGE
    6.
    发明申请
    IC CARD AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE PACKAGE 失效
    IC卡和半导体集成电路器件封装

    公开(公告)号：US20080158835A1

    公开(公告)日：2008-07-03

    申请号：US12037713

    申请日：2008-02-26

    申请人： Takuya TAKAHASHI ,  Kazuhiro Yamamoto ,  Minoru Ohara

    发明人： Takuya TAKAHASHI ,  Kazuhiro Yamamoto ,  Minoru Ohara

    IPC分类号： H05K5/02

    CPC分类号： G06K19/07745 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

    摘要翻译： IC卡包括具有一个表面和与一个表面相对的另一个表面的半导体集成电路器件封装，在封装的一个表面上的卡片端子，以及包括附接到封装的另一个表面的凹入部分的基卡。 该封装包括布线板，布线板上的半导体集成电路芯片和涂覆在半导体集成电路芯片上的绝缘树脂。 包装是一个长方体包装。 绝缘树脂暴露于包装的另一个表面。 除了一个表面和另一个表面之外，绝缘树脂和布线板暴露于封装的四个表面。

    Device and method for producing sheet for abrasive coating and the sheet
    7.
    发明申请
    Device and method for producing sheet for abrasive coating and the sheet 审中-公开
    用于研磨涂层和片材生产片材的装置和方法

    公开(公告)号：US20060078674A1

    公开(公告)日：2006-04-13

    申请号：US10515438

    申请日：2003-11-27

    申请人： Minoru Ohara

    发明人： Minoru Ohara

    IPC分类号： B05C11/02 ,  E01F9/04 ,  B05D1/36

    CPC分类号： B24D11/001 ,  Y10T428/24372

    摘要： A sheet pan (120) having a groove (121), into which a brazing sheet is fitted, is disposed on a base (110). A slide member (140) can slidingly move along the longitudinal direction of the sheet pan (120) at a position above the sheet pan (120). A blade (160) is moved upward and downward by a micrometer (170) fixed to and supported by the slide member (140). A brazing sheet is fitted into the groove (121), and coated with an abrasive coating material. The slide member (140) is slid, with the clearance between the blade (160) and the sheet pan (110) being adjusted using the micrometer (170). As a result, a surplus of the abrasive coating material is scraped off, and the abrasive coating material becomes uniform in thickness. Thus, an abrasive coating sheet high in quality and uniform in the thickness of the abrasive coating material can be produced conveniently.

    摘要翻译： 具有凹槽（121）的片状盘（120）设置在基座（110）上，钎焊片安装在其中。 滑动构件（140）可以在片状盘（120）上方的位置沿片状盘（120）的纵向方向滑动移动。 刀片（160）通过固定到滑动构件（140）并由其支撑的千分尺（170）向上和向下移动。 将钎焊片装配到凹槽（121）中，并涂覆有磨料涂层材料。 滑动构件（140）滑动，使用千分尺（170）调节叶片（160）和片状盘（110）之间的间隙。 结果，擦去了磨料涂层材料的剩余部分，并且磨料涂层材料的厚度变得均匀。 因此，可以方便地制造质量高且磨料涂层材料的厚度均匀的磨料涂层片。