公开(公告)号：US20150158716A1

公开(公告)日：2015-06-11

申请号：US14098974

申请日：2013-12-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Shyh-Wei CHENG ,  Jui-Chun WENG ,  Hsi-Cheng HSU ,  Chih-Yu WANG ,  Chuan-Yi KO ,  Ji-Hong CHIANG ,  Chung-Hsien HUNG ,  Hsin-Yu CHEN ,  Chih-Hsien CHEN ,  Yu-Mei WU ,  Jong CHEN

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81B3/0005

Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.

Abstract translation: 提供了用于形成微机电系统（MEMS）装置的机构的实施例。 MEMS器件包括设置在衬底上的衬底和MEMS衬底。 MEMS基板包括可移动元件，固定元件和连接到可移动元件和固定元件的至少一个弹簧。 MEMS器件还包括可移动元件上的多晶硅层。