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公开(公告)号：US20210193166A1
公开(公告)日：2021-06-24
申请号：US16721684
申请日：2019-12-19
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG
Abstract: An arcing detection system detects arcing within a semiconductor processing cleanroom environment. The arcing detection system includes an array of microphones positioned within the cleanroom environment. The microphones receive soundwaves within the cleanroom environment and generate audio signals based on the sound waves. The arcing system includes a control system that receives the audio signals from the microphones. The control system analyzes the audio signals and detects arcing within the cleanroom environment based on the audio signals. The control system can adjust a semiconductor process in real time responsive to detecting arcing.
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公开(公告)号：US20190143474A1
公开(公告)日：2019-05-16
申请号：US16175778
申请日：2018-10-30
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Chih-Yu WANG , Tien-Wen WANG , In-Tsang LIN , Vivian CHOU
IPC: B24B37/005 , B24B37/013 , H01L21/306 , H01L21/66 , H01L21/67
Abstract: An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an action based on the received feedback signal.
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3.发明申请公开(公告)号：US20220359244A1
公开(公告)日：2022-11-10
申请号：US17872941
申请日：2022-07-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG
Abstract: A plasma discharge detection system detects undesirable plasma discharge events within a semiconductor process chamber. The plasma discharge detection system includes one or more cameras positioned around the semiconductor process chamber. The cameras capture images from within the semiconductor process chamber. The plasma discharge detection system includes a control system that receives the images from the cameras. The control system analyzes the images and detects plasma discharge within the semiconductor process chamber based on the images. The control system can adjust a semiconductor process in real time responsive to detecting the plasma discharge.
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公开(公告)号：US20200371046A1
公开(公告)日：2020-11-26
申请号：US16806199
申请日：2020-03-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG , Hsi-Cheng HSU
Abstract: Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
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公开(公告)号：US20220365001A1
公开(公告)日：2022-11-17
申请号：US17878428
申请日：2022-08-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG , Hsi-Cheng HSU
Abstract: Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20210305074A1
公开(公告)日：2021-09-30
申请号：US16836639
申请日：2020-03-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG
Abstract: A plasma discharge detection system detects undesirable plasma discharge events within a semiconductor process chamber. The plasma discharge detection system includes one or more cameras positioned around the semiconductor process chamber. The cameras capture images from within the semiconductor process chamber. The plasma discharge detection system includes a control system that receives the images from the cameras. The control system analyzes the images and detects plasma discharge within the semiconductor process chamber based on the images. The control system can adjust a semiconductor process in real time responsive to detecting the plasma discharge.
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公开(公告)号：US20150158716A1
公开(公告)日：2015-06-11
申请号：US14098974
申请日：2013-12-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
Inventor： Shyh-Wei CHENG , Jui-Chun WENG , Hsi-Cheng HSU , Chih-Yu WANG , Chuan-Yi KO , Ji-Hong CHIANG , Chung-Hsien HUNG , Hsin-Yu CHEN , Chih-Hsien CHEN , Yu-Mei WU , Jong CHEN
CPC classification number: B81B3/001 , B81B3/0005
Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
Abstract translation: 提供了用于形成微机电系统（MEMS）装置的机构的实施例。 MEMS器件包括设置在衬底上的衬底和MEMS衬底。 MEMS基板包括可移动元件，固定元件和连接到可移动元件和固定元件的至少一个弹簧。 MEMS器件还包括可移动元件上的多晶硅层。
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公开(公告)号：US20240385124A1
公开(公告)日：2024-11-21
申请号：US18789598
申请日：2024-07-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG , Hsi-Cheng HSU
Abstract: Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
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公开(公告)号：US20230393081A1
公开(公告)日：2023-12-07
申请号：US18448766
申请日：2023-08-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Yu WANG , Hsi-Cheng HSU
CPC classification number: G01N21/9505 , H01L21/50 , H01L22/12 , H01L2021/60112
Abstract: Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
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10.发明申请公开(公告)号：US20190148191A1
公开(公告)日：2019-05-16
申请号：US16129746
申请日：2018-09-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Chih-Yu WANG , Tien-Wen WANG , Vivian CHOU , In-Tsang LIN
Abstract: In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.
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