公开(公告)号：US20240404991A1

公开(公告)日：2024-12-05

申请号：US18328430

申请日：2023-06-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chao-Wen Shih ,  Min-Chien Hsiao ,  Kuo-Chiang Ting ,  Yen-Ming Chen ,  Ashish Kumar Sahoo ,  Chen-Sheng Lin ,  Hsin-Yu Pan

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: Embodiments include methods of forming three-dimensional packages and the packages resulting therefrom. The packages may utilize a bridge die to electrically connect one die to another die and at least one additional die adjacent to the bridge die. The height-to-width ratio of the gap between the bridge die and the at least one additional die is controlled by thinning the bridge die to be thinner than the at least one additional die. The packages may utilize landing structures to adjoin a dielectric material of an attached die to a metallic landing structure of a base die.