公开(公告)号：US20200058521A1

公开(公告)日：2020-02-20

申请号：US16539265

申请日：2019-08-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kun-Hsiung SHIH ,  Bo-Chen CHEN ,  Yung-Li TSAI ,  Chui-Ya PENG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.