公开(公告)号：US20240363377A1

公开(公告)日：2024-10-31

申请号：US18767854

申请日：2024-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsui-Wei WANG ,  Yung-Li TSAI ,  Chui-Ya PENG

IPC: H01L21/67 ,  B08B15/04 ,  H01L21/02

CPC classification number: H01L21/6715 ,  B08B15/04 ,  H01L21/02057 ,  H01L21/67051

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

公开(公告)号：US20200058521A1

公开(公告)日：2020-02-20

申请号：US16539265

申请日：2019-08-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kun-Hsiung SHIH ,  Bo-Chen CHEN ,  Yung-Li TSAI ,  Chui-Ya PENG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.

公开(公告)号：US20200055099A1

公开(公告)日：2020-02-20

申请号：US16532701

申请日：2019-08-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Bo Chen CHEN ,  Sheng-Wei WU ,  Yung-Li TSAI

IPC: B08B7/04 ,  B08B1/00 ,  B08B1/02 ,  B08B3/04 ,  A46B13/02 ,  H01L21/67 ,  H01L21/02

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.