公开(公告)号：US20250053064A1

公开(公告)日：2025-02-13

申请号：US18448337

申请日：2023-08-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Su-Chun Yang ,  Chen Chiang Yu ,  Jui Hsuan Tsai ,  Jih-Churng Twu ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G02F1/355 ,  G02F1/35

Abstract: Optical devices and methods of manufacture are presented in which a non-linear material is deposited or otherwise placed. Once the non-linear material has been deposited, implantation regions are formed within the non-linear material using an implantation process. The implantation regions are removed using an etching process, and electrodes are formed to the remaining material.

公开(公告)号：US20230402345A1

公开(公告)日：2023-12-14

申请号：US17806532

申请日：2022-06-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen Chiang Yu ,  Tsung-Fu Tsai ,  Szu-Wei Lu

IPC: H01L23/367 ,  H01L21/48

CPC classification number: H01L23/3677 ,  H01L21/4882

Abstract: A semiconductor package including a cooling system and a method of forming are provided. The semiconductor package may include an interposer, one or more package components bonded to the interposer, an encapsulant on the interposer, and a cooling system over the one or more package components. The cooling system may include one or more metal layers on top surfaces of the one or more package components, first metal pins on the one or more metal layers, second metal pins, wherein each of the second metal pins may be bonded to a corresponding one of the first metal pins by solder, and a first lid over the second metal pins, wherein the first lid may include openings.