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公开(公告)号：US10899608B2
公开(公告)日：2021-01-26
申请号：US16584719
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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公开(公告)号：US10556792B2
公开(公告)日：2020-02-11
申请号：US15823969
申请日：2017-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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公开(公告)号：US11289533B2
公开(公告)日：2022-03-29
申请号：US17007455
申请日：2020-08-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , H01L31/16 , G06K9/00 , H01L31/167 , H01L27/32 , H01L27/15
Abstract: A method of fabricating a sensing apparatus is disclosed. The method includes providing a substrate that includes a plurality of image sensors, forming an optical filtering film on the substrate, and forming a collimator on the optical filtering film. The method further includes forming a blocking layer on the collimator and forming an illumination layer on the blocking layer. The illumination layer is configured to illuminate an object placed above the illumination layer. The image sensors are configured to detect a portion of light reflected from the object.
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公开(公告)号：US20200024136A1
公开(公告)日：2020-01-23
申请号：US16584719
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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公开(公告)号：US20240371911A1
公开(公告)日：2024-11-07
申请号：US18777025
申请日：2024-07-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , G06V40/13 , H01L27/15 , H01L31/16 , H01L31/167 , H10K59/12 , H10K59/17 , H10K59/35 , H10K59/65
Abstract: A display apparatus includes a display layer including a plurality of light emitting pixels, a blocking layer including a plurality of openings disposed under the sensing region, a light conditioning layer under the blocking layer, and an image sensing layer under the light conditioning layer. In a top view of the display apparatus, the portion of the light emitting pixels within the sensing region are arranged in columns, the openings of the blocking layer are arranged in columns, and the columns of the openings are interleaved with the columns of the light emitting pixels.
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Patent Agency Ranking
公开(公告)号：US20220216263A1
公开(公告)日：2022-07-07
申请号：US17705791
申请日：2022-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , H01L31/16 , G06K9/00 , H01L31/167 , H01L27/32
Abstract: A display apparatus is disclosed. The display apparatus includes a sensor layer including a plurality of sensors, a pixel layer disposed on the sensor layer and including a plurality of pixel areas and a plurality of pixels in the pixel areas, and an opaque layer disposed between the sensor layer and the pixel layer and including holes corresponding to at least one of the pixel areas.
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公开(公告)号：US10763296B2
公开(公告)日：2020-09-01
申请号：US15905391
申请日：2018-02-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , H01L31/16 , G06K9/00 , H01L31/167 , H01L27/32 , H01L27/15
Abstract: A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.
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公开(公告)号：US12094914B2
公开(公告)日：2024-09-17
申请号：US17705791
申请日：2022-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , G06V40/13 , H01L31/16 , H01L31/167 , H10K59/65 , H01L27/15 , H10K59/12 , H10K59/17 , H10K59/35
CPC classification number: H01L27/14678 , G06V40/1318 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14636 , H01L27/14685 , H01L31/16 , H01L31/167 , H10K59/65 , H01L27/156 , H10K59/12 , H10K59/17 , H10K59/351
Abstract: A display apparatus is disclosed. The display apparatus includes a sensor layer including a plurality of sensors, a pixel layer disposed on the sensor layer and including a plurality of pixel areas and a plurality of pixels in the pixel areas, and an opaque layer disposed between the sensor layer and the pixel layer and including holes corresponding to at least one of the pixel areas.
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公开(公告)号：US20200024137A1
公开(公告)日：2020-01-23
申请号：US16584752
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
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公开(公告)号：US20190157337A1
公开(公告)日：2019-05-23
申请号：US15905391
申请日：2018-02-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , H01L31/16
Abstract: A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.
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