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公开(公告)号：US11861928B2
公开(公告)日：2024-01-02
申请号：US17993319
申请日：2022-11-23
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： You-Cheng Jhang , Han-Zong Pan , Wei-Ding Wu , Jiu-Chun Weng , Hsin-Yu Chen , Cheng-San Chou , Chin-Min Lin
IPC: G06V40/13 , G02B27/30 , G06F3/041 , G06F21/32 , H01L27/146
CPC classification number: G06V40/13 , G02B27/30 , G06F3/0412 , G06F21/32 , H01L27/14625
Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.
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公开(公告)号：US10899608B2
公开(公告)日：2021-01-26
申请号：US16584719
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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公开(公告)号：US10556792B2
公开(公告)日：2020-02-11
申请号：US15823969
申请日：2017-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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4.发明申请公开(公告)号：US20160130137A1
公开(公告)日：2016-05-12
申请号：US14557513
申请日：2014-12-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsin-Ting Huang , Hsiang-Fu Chen , Wen-Chuan Tai , Shao-Chi Yu , Chia-Ming Hung , Allen Timothy Chang , Bruce C.S. Chou , Chin-Min Lin
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81B2207/096 , B81C2203/0145
Abstract: Some embodiments relate to multiple MEMS devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (MEMS) devices is bonded to a capping structure. The capping structure comprises a first cavity arranged over the first MEMS device and a second cavity arranged over the second MEMS device. The first cavity is filled with a first gas at a first gas pressure. The second cavity is filled with a second gas at a second gas pressure, which is different from the first gas pressure. A recess is arranged within a lower surface of the capping structure. The recess abuts the second cavity. A vent is arranged within the capping structure. The vent extends from a top of the recess to the upper surface of the capping structure. A lid is arranged within the vent and configured to seal the second cavity.
Abstract translation: 一些实施例涉及在单个基板上集成在一起的多个MEMS器件。 包括第一和第二微机电系统（MEMS）装置的装置基板被结合到封盖结构。 封盖结构包括布置在第一MEMS器件上的第一腔和布置在第二MEMS器件上的第二腔。 第一腔体以第一气体压力填充第一气体。 第二腔体以与第一气体压力不同的第二气体压力填充第二气体。 凹口布置在封盖结构的下表面内。 凹槽邻接第二腔。 在封盖结构内设有排气口。 通气孔从凹槽的顶部延伸到封盖结构的上表面。 盖子布置在通气口内并构造成密封第二腔体。
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公开(公告)号：US10961118B2
公开(公告)日：2021-03-30
申请号：US16584752
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
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Patent Agency Ranking
公开(公告)号：US20190161346A1
公开(公告)日：2019-05-30
申请号：US15823969
申请日：2017-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
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公开(公告)号：US20170309675A1
公开(公告)日：2017-10-26
申请号：US15647968
申请日：2017-07-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Ching-Chun Wang , Dun-Nian Yaung , Chun-Ming Su , Tzu-Hsuan Hsu
IPC: H01L27/146 , H04N9/04
CPC classification number: H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14643 , H04N9/045
Abstract: A device includes a semiconductor substrate, a plurality of micro-lenses disposed on the substrate, each micro-lens being configured to direct light radiation to a layer beneath the plurality of micro-lenses. The device further includes a transparent layer positioned between the plurality of micro-lenses and the substrate, the transparent layer comprising a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses, wherein the structure and the transparent material are coplanar at respective top surfaces and bottom surfaces thereof.
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公开(公告)号：US12094914B2
公开(公告)日：2024-09-17
申请号：US17705791
申请日：2022-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , G06V40/13 , H01L31/16 , H01L31/167 , H10K59/65 , H01L27/15 , H10K59/12 , H10K59/17 , H10K59/35
CPC classification number: H01L27/14678 , G06V40/1318 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14636 , H01L27/14685 , H01L31/16 , H01L31/167 , H10K59/65 , H01L27/156 , H10K59/12 , H10K59/17 , H10K59/351
Abstract: A display apparatus is disclosed. The display apparatus includes a sensor layer including a plurality of sensors, a pixel layer disposed on the sensor layer and including a plurality of pixel areas and a plurality of pixels in the pixel areas, and an opaque layer disposed between the sensor layer and the pixel layer and including holes corresponding to at least one of the pixel areas.
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公开(公告)号：US20200024137A1
公开(公告)日：2020-01-23
申请号：US16584752
申请日：2019-09-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chia Lee , Chin-Min Lin , Cheng San Chou , Hsiang-Fu Chen , Wen-Chuan Tai , Ching-Kai Shen , Hua-Shu Ivan Wu , Fan Hu
Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
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公开(公告)号：US20190157337A1
公开(公告)日：2019-05-23
申请号：US15905391
申请日：2018-02-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chin-Min Lin , Cheng San Chou
IPC: H01L27/146 , H01L31/16
Abstract: A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.
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