公开(公告)号：US12027554B2

公开(公告)日：2024-07-02

申请号：US17144757

申请日：2021-01-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Che Wei Yang ,  Sheng-Chan Li ,  Tsun-Kai Tsao ,  Chih-Cheng Shih ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14689

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first image sensing element and a second image sensing element arranged over a substrate. A first micro-lens is arranged over the first image sensing element, and a second micro-lens is arranged over the second image sensing element. A composite deep trench isolation structure is arranged between the first and second image sensing elements. The composite deep trench isolation structure includes a lower portion arranged over the substrate and an upper portion arranged over the lower portion. The lower portion includes a first material, and the upper portion includes a second material that has a higher reflectivity than the first material.

公开(公告)号：US20220223634A1

公开(公告)日：2022-07-14

申请号：US17144757

申请日：2021-01-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Che Wei Yang ,  Sheng-Chan Li ,  Tsun-Kai Tsao ,  Chih-Cheng Shih ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: H01L27/146

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first image sensing element and a second image sensing element arranged over a substrate. A first micro-lens is arranged over the first image sensing element, and a second micro-lens is arranged over the second image sensing element. A composite deep trench isolation structure is arranged between the first and second image sensing elements. The composite deep trench isolation structure includes a lower portion arranged over the substrate and an upper portion arranged over the lower portion. The lower portion includes a first material, and the upper portion includes a second material that has a higher reflectivity than the first material.