公开(公告)号：US20230125195A1

公开(公告)日：2023-04-27

申请号：US18067960

申请日：2022-12-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Ching-Hong Jiang ,  Kuo-Yin Lin ,  Ming-Shiuan She ,  Shen-Nan Lee ,  Teng-Chun Tsai ,  Yung-cheng Lu

IPC: B24B37/20 ,  B24B37/32

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

公开(公告)号：US11865666B2

公开(公告)日：2024-01-09

申请号：US18067960

申请日：2022-12-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Ching-Hong Jiang ,  Kuo-Yin Lin ,  Ming-Shiuan She ,  Shen-Nan Lee ,  Teng-Chun Tsai ,  Yung-Cheng Lu

IPC: B24B37/32 ,  B24B37/20 ,  B24B37/04

CPC classification number: B24B37/20 ,  B24B37/042 ,  B24B37/32

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.