公开(公告)号：US09097972B2

公开(公告)日：2015-08-04

申请号：US13752954

申请日：2013-01-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yen-Chen Lin ,  Ching-Hsin Chang ,  Chia-Hung Chu ,  Hu-Wei Lin ,  Chih-Hsien Hsu ,  Hong-Hsing Chou

IPC: H01L21/36 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16

CPC classification number: G03F7/0387 ,  G03F7/039 ,  G03F7/162

Abstract: A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.

Abstract translation: 一种方法包括在半导体衬底上分配第一溶剂; 在第一溶剂上分配第一层高粘度聚合物; 在第一层高粘度聚合物上分配第二溶剂; 并且在分配第二溶剂之后旋转半导体衬底，以将高粘度聚合物扩散到半导体衬底的周围。

公开(公告)号：US20140210057A1

公开(公告)日：2014-07-31

申请号：US13752954

申请日：2013-01-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yen-Chen Lin ,  Ching-Hsin Chang ,  Chia-Hung Chu ,  Hu-Wei Lin ,  Chih-Hsien Hsu ,  Hong-Hsing Chou

IPC: G03F7/00 ,  H01L29/02

CPC classification number: G03F7/0387 ,  G03F7/039 ,  G03F7/162

Abstract: A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.

Abstract translation: 一种方法包括在半导体衬底上分配第一溶剂; 在第一溶剂上分配第一层高粘度聚合物; 在第一层高粘度聚合物上分配第二溶剂; 并且在分配第二溶剂之后旋转半导体衬底，以将高粘度聚合物扩散到半导体衬底的周围。