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公开(公告)号：US10283457B2
公开(公告)日：2019-05-07
申请号：US16114567
申请日：2018-08-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L23/544 , G03F7/20 , H01L21/027 , H01L21/308 , H01L21/67
Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.
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公开(公告)号：US20140210057A1
公开(公告)日：2014-07-31
申请号：US13752954
申请日：2013-01-29
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Yen-Chen Lin , Ching-Hsin Chang , Chia-Hung Chu , Hu-Wei Lin , Chih-Hsien Hsu , Hong-Hsing Chou
CPC classification number: G03F7/0387 , G03F7/039 , G03F7/162
Abstract: A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.
Abstract translation: 一种方法包括在半导体衬底上分配第一溶剂; 在第一溶剂上分配第一层高粘度聚合物; 在第一层高粘度聚合物上分配第二溶剂; 并且在分配第二溶剂之后旋转半导体衬底，以将高粘度聚合物扩散到半导体衬底的周围。
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公开(公告)号：US10283456B2
公开(公告)日：2019-05-07
申请号：US15154181
申请日：2016-05-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L21/67 , H01L23/544 , G03F7/20 , H01L21/027 , H01L21/308
Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures. The mobile reticle therefore allows for different strings of substrate identification marks to be formed within the photoresistive material using a same reticle, thereby economically providing the benefits of lithographic substrate marking.
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公开(公告)号：US20170117227A1
公开(公告)日：2017-04-27
申请号：US15154181
申请日：2016-05-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L23/544 , G03F7/20 , H01L21/67 , H01L21/027 , H01L21/308
CPC classification number: H01L23/544 , G03F7/70141 , G03F7/70541 , H01L21/0274 , H01L21/3086 , H01L21/67282 , H01L2223/54426 , H01L2223/54433
Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures. The mobile reticle therefore allows for different strings of substrate identification marks to be formed within the photoresistive material using a same reticle, thereby economically providing the benefits of lithographic substrate marking.
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公开(公告)号：US11562968B2
公开(公告)日：2023-01-24
申请号：US16402574
申请日：2019-05-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L23/544 , G03F7/20 , H01L21/027 , H01L21/67 , F21K9/00 , G03F9/00 , H01L21/308
Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.
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Patent Agency Ranking
公开(公告)号：US20190259710A1
公开(公告)日：2019-08-22
申请号：US16402574
申请日：2019-05-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L23/544 , H01L21/308 , G03F7/20 , H01L21/67 , H01L21/027
Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.
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公开(公告)号：US20240395571A1
公开(公告)日：2024-11-28
申请号：US18790969
申请日：2024-07-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Ying-Hao Wang , Chien-Lung Chen , Chien-Chi Tzeng , Meng-Fu Shih , Hu-Wei Lin
IPC: H01L21/67 , H01L21/677
Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
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公开(公告)号：US20230377910A1
公开(公告)日：2023-11-23
申请号：US17751185
申请日：2022-05-23
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Ying-Hao Wang , Chien-Lung Chen , Chien-Chi Tzeng , Meng-Fu Shih , Hu-Wei Lin
IPC: H01L21/67 , H01L21/677
CPC classification number: H01L21/67051 , H01L21/67121 , H01L21/67706 , H01L21/67742
Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
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公开(公告)号：US20230351577A1
公开(公告)日：2023-11-02
申请号：US17730585
申请日：2022-04-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： I-Hsuan Chen , Ying-Hao Wang , Chien-Lung Chen , Chien-Chi Tzeng , Hu-Wei Lin
CPC classification number: G06T7/0004 , G01N1/44 , G01N21/9501 , G01N35/00 , G06T7/70 , H01L22/12 , H04N5/372 , G01N2035/00346 , G06T2207/30148
Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.
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10.发明申请公开(公告)号：US20180366415A1
公开(公告)日：2018-12-20
申请号：US16114567
申请日：2018-08-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
IPC: H01L23/544 , H01L21/67 , H01L21/027 , G03F7/20 , H01L21/308
CPC classification number: H01L23/544 , G03F7/70141 , G03F7/70541 , H01L21/0274 , H01L21/3086 , H01L21/67282 , H01L2223/54426 , H01L2223/54433
Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.
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