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公开(公告)号：US20190394573A1
公开(公告)日：2019-12-26
申请号：US16016996
申请日：2018-06-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai
Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
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Patent Agency Ranking
公开(公告)号：US11089408B2
公开(公告)日：2021-08-10
申请号：US16907657
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai
Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
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公开(公告)号：US20200322733A1
公开(公告)日：2020-10-08
申请号：US16907657
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai
Abstract: AMEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
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公开(公告)号：US20220289556A1
公开(公告)日：2022-09-15
申请号：US17352870
申请日：2021-06-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai , Wen Cheng Kuo
Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.
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公开(公告)号：US12054383B2
公开(公告)日：2024-08-06
申请号：US17352870
申请日：2021-06-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai , Wen Cheng Kuo
CPC classification number: B81B3/0021 , B81C1/00246 , B81B2201/0235 , B81B2201/0257 , B81B2203/0109 , B81B2203/0127 , B81B2207/015 , B81B2207/09
Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.
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公开(公告)号：US10715924B2
公开(公告)日：2020-07-14
申请号：US16016996
申请日：2018-06-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai
Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
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