公开(公告)号：US10811377B2

公开(公告)日：2020-10-20

申请号：US16194927

申请日：2018-11-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Hung Chen ,  Yu-Nu Hsu ,  Chun-Chen Liu ,  Heng-Chi Huang ,  Chien-Chen Li ,  Shih-Yen Chen ,  Cheng-Nan Hsieh ,  Kuo-Chio Liu ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Te-Hsun Pang ,  Yuan-Feng Wu ,  Sen-Chi Chiang

IPC: H01L23/20 ,  H01L23/498 ,  H01L23/00

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 μm to about 3 μm. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.