公开(公告)号：US12153433B2

公开(公告)日：2024-11-26

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Cheng-Hung Chen ,  Yan-Han Chen ,  Feng-Kuang Wu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US11334080B2

公开(公告)日：2022-05-17

申请号：US16580977

申请日：2019-09-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Cheng-Hung Chen ,  Yan-Han Chen ,  Feng-Kuang Wu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US11152238B2

公开(公告)日：2021-10-19

申请号：US16201312

申请日：2018-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Sheng-Hsiang Chuang ,  Cheng-Hung Chen

IPC: G05B19/18 ,  H01L21/67 ,  H01L21/687

Abstract: In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.

公开(公告)号：US10811377B2

公开(公告)日：2020-10-20

申请号：US16194927

申请日：2018-11-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Hung Chen ,  Yu-Nu Hsu ,  Chun-Chen Liu ,  Heng-Chi Huang ,  Chien-Chen Li ,  Shih-Yen Chen ,  Cheng-Nan Hsieh ,  Kuo-Chio Liu ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Te-Hsun Pang ,  Yuan-Feng Wu ,  Sen-Chi Chiang

IPC: H01L23/20 ,  H01L23/498 ,  H01L23/00

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 μm to about 3 μm. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.