公开(公告)号：US20170309675A1

公开(公告)日：2017-10-26

申请号：US15647968

申请日：2017-07-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chin-Min Lin ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Chun-Ming Su ,  Tzu-Hsuan Hsu

IPC: H01L27/146 ,  H04N9/04

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H04N9/045

Abstract: A device includes a semiconductor substrate, a plurality of micro-lenses disposed on the substrate, each micro-lens being configured to direct light radiation to a layer beneath the plurality of micro-lenses. The device further includes a transparent layer positioned between the plurality of micro-lenses and the substrate, the transparent layer comprising a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses, wherein the structure and the transparent material are coplanar at respective top surfaces and bottom surfaces thereof.