公开(公告)号：US20200161160A1

公开(公告)日：2020-05-21

申请号：US16588182

申请日：2019-09-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yi-Fam SHIU ,  Eason CHEN ,  Yang-Ann CHU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

公开(公告)号：US20230317505A1

公开(公告)日：2023-10-05

申请号：US18206544

申请日：2023-06-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yi-Fam SHIU ,  Eason CHEN ,  Yang-Ann CHU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L23/433

CPC classification number: H01L21/68707 ,  H01L21/67294 ,  H01L21/6773 ,  H01L21/67706 ,  H01L23/433 ,  H01L2021/60105

Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.