公开(公告)号：US20230317505A1

公开(公告)日：2023-10-05

申请号：US18206544

申请日：2023-06-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yi-Fam SHIU ,  Eason CHEN ,  Yang-Ann CHU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L23/433

CPC classification number: H01L21/68707 ,  H01L21/67294 ,  H01L21/6773 ,  H01L21/67706 ,  H01L23/433 ,  H01L2021/60105

Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

公开(公告)号：US20210078809A1

公开(公告)日：2021-03-18

申请号：US17087216

申请日：2020-11-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Yi-Fam SHIU ,  Chueng-Jen WANG ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: B65G47/86 ,  B65G15/28

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US20220384222A1

公开(公告)日：2022-12-01

申请号：US17884065

申请日：2022-08-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Yi-Fam SHIU ,  Chueng-Jen WANG ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/66 ,  H01L21/683

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US20200161160A1

公开(公告)日：2020-05-21

申请号：US16588182

申请日：2019-09-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yi-Fam SHIU ,  Eason CHEN ,  Yang-Ann CHU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67

Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.