公开(公告)号：US20220037266A1

公开(公告)日：2022-02-03

申请号：US16944102

申请日：2020-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Shih-Ting Lin ,  Szu-Wei Lu ,  Chen-Hsuan Tsai ,  I-Ting Huang

IPC: H01L23/00 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48

Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has a first surface and a second surface opposite to the first surface. The wiring substrate is disposed on the first surface of the redistribution circuit structure. The semiconductor device is disposed on the second surface of the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is directly in contact with the insulating encapsulation.

公开(公告)号：US10923438B2

公开(公告)日：2021-02-16

申请号：US16396001

申请日：2019-04-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Kung-Chen Yeh ,  I-Ting Huang ,  Shih-Ting Lin ,  Szu-Wei Lu

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/544 ,  H01L21/683 ,  H01L21/768 ,  H01L21/78 ,  H01L25/00 ,  H01L25/18

Abstract: A package structure and method for forming the same are provided. The method includes forming a through substrate via structure in a substrate, and forming a first trench in the substrate. The method includes stacking a first stacked die package structure over the substrate using a plurality of first bonding structures. The first bonding structures are between the substrate and the first stacked die package structure, and a there is plurality of cavities between two adjacent first bonding structures. The method also includes forming an underfill layer over the first stacked die package structure and in the cavities, and the underfill layer is formed in a portion of the first trench. The method further includes forming a package layer over the underfill layer.

公开(公告)号：US11355454B2

公开(公告)日：2022-06-07

申请号：US16944102

申请日：2020-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Fu Tsai ,  Shih-Ting Lin ,  Szu-Wei Lu ,  Chen-Hsuan Tsai ,  I-Ting Huang

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683

Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has a first surface and a second surface opposite to the first surface. The wiring substrate is disposed on the first surface of the redistribution circuit structure. The semiconductor device is disposed on the second surface of the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is directly in contact with the insulating encapsulation.