公开(公告)号：US11387164B2

公开(公告)日：2022-07-12

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L21/52 ,  H01L23/40 ,  H01L23/498 ,  H01L23/473 ,  H01L23/42

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

公开(公告)号：US20210066164A1

公开(公告)日：2021-03-04

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L23/40 ,  H01L23/498 ,  H01L21/52

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

公开(公告)号：US11107747B2

公开(公告)日：2021-08-31

申请号：US16419672

申请日：2019-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Jen-Yu Wang ,  Chung-Jung Wu ,  Chih-Hang Tung ,  Chen-Hua Yu

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18

Abstract: A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.

公开(公告)号：US11342242B2

公开(公告)日：2022-05-24

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L21/52 ,  H01L23/40 ,  H01L23/498 ,  H01L23/473 ,  H01L23/42

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.