公开(公告)号：US11387164B2

公开(公告)日：2022-07-12

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L21/52 ,  H01L23/40 ,  H01L23/498 ,  H01L23/473 ,  H01L23/42

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

公开(公告)号：US11996351B2

公开(公告)日：2024-05-28

申请号：US17841007

申请日：2022-06-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/473 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/585 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US20210066164A1

公开(公告)日：2021-03-04

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L23/40 ,  H01L23/498 ,  H01L21/52

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

公开(公告)号：US20230420337A1

公开(公告)日：2023-12-28

申请号：US17809128

申请日：2022-06-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L23/40 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L23/4006 ,  H01L25/0655 ,  H01L2924/15311 ,  H01L2224/16227 ,  H01L2023/4087 ,  H01L2023/405 ,  H01L2224/16238 ,  H01L24/16

Abstract: Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.

公开(公告)号：US11410910B2

公开(公告)日：2022-08-09

申请号：US17114886

申请日：2020-12-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US11342242B2

公开(公告)日：2022-05-24

申请号：US16798431

申请日：2020-02-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Sheng-Tsung Hsiao ,  Jen-Yu Wang

IPC: H01L23/46 ,  H01L21/52 ,  H01L23/40 ,  H01L23/498 ,  H01L23/473 ,  H01L23/42

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

公开(公告)号：US20220310482A1

公开(公告)日：2022-09-29

申请号：US17841007

申请日：2022-06-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US20220037231A1

公开(公告)日：2022-02-03

申请号：US17114886

申请日：2020-12-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US20240249999A1

公开(公告)日：2024-07-25

申请号：US18605947

申请日：2024-03-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/473 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/585 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US11107747B2

公开(公告)日：2021-08-31

申请号：US16419672

申请日：2019-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Jen-Yu Wang ,  Chung-Jung Wu ,  Chih-Hang Tung ,  Chen-Hua Yu

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18

Abstract: A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.