公开(公告)号：US20230400699A1

公开(公告)日：2023-12-14

申请号：US18231760

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yu CHEN ,  Yen-Chiang LIU ,  June-Jie CHIOU ,  Jia-Syuan LI ,  You-Cheng JHANG ,  Shin-Hua CHEN ,  LAVANYA SANAGAVARAPU ,  Han-Zong PAN ,  Chun-Peng LI ,  Chia-Chun HUNG ,  Ching-Hsiang HU ,  Wei-Ding WU ,  Jui-Chun WENG ,  Ji-Hong CHIANG ,  Hsi-Cheng HSU

IPC: G02B27/30 ,  G02B5/20 ,  G02B26/00 ,  H01L27/146 ,  H01L31/0216 ,  G06V40/13

CPC classification number: G02B27/30 ,  G02B5/20 ,  G02B26/007 ,  H01L27/14625 ,  H01L31/02162 ,  H01L27/1462 ,  G06V40/1312 ,  B32B2551/00 ,  G06V40/1318

Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.