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公开(公告)号：US20210351048A1
公开(公告)日：2021-11-11
申请号：US16870499
申请日：2020-05-08
发明人： Kai-Wen WU , Chun-Ta CHEN , Chin-Shen HSIEH , Cheng-Yi HUANG
IPC分类号： H01L21/67 , H01L21/324 , F27B17/00 , F27D5/00 , F27D3/00
摘要： In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.
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公开(公告)号：US20240304471A1
公开(公告)日：2024-09-12
申请号：US18666710
申请日：2024-05-16
发明人： Kai-Wen WU , Chun-Ta CHEN , Chin-Shen HSIEH , Cheng-Yi HUANG
IPC分类号： H01L21/67 , F27B17/00 , F27D3/00 , F27D5/00 , H01L21/324
CPC分类号： H01L21/67103 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/324
摘要： In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.
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公开(公告)号：US20220319880A1
公开(公告)日：2022-10-06
申请号：US17843602
申请日：2022-06-17
发明人： Kai-Wen WU , Chu-Ta Chen , Chin-Shen Hsieh , Cheng-Yi Huang
IPC分类号： H01L21/67 , F27B17/00 , F27D3/00 , F27D5/00 , H01L21/324
摘要： In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.
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