公开(公告)号：US20190143478A1

公开(公告)日：2019-05-16

申请号：US15965685

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chou-Zon LIA ,  Kit Chen ,  Stone Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/306 ,  H01L21/677 ,  B24B37/04

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.