公开(公告)号：US11267099B2

公开(公告)日：2022-03-08

申请号：US15994088

申请日：2018-05-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC: B24B37/32 ,  B24B37/20 ,  B24B37/015 ,  H01L21/321

Abstract: In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.

公开(公告)号：US20230133331A1

公开(公告)日：2023-05-04

申请号：US18149489

申请日：2023-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

IPC: B24B37/16 ,  B24B49/12 ,  B24B37/013

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

公开(公告)号：US20190143478A1

公开(公告)日：2019-05-16

申请号：US15965685

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chou-Zon LIA ,  Kit Chen ,  Stone Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/306 ,  H01L21/677 ,  B24B37/04

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

公开(公告)号：US11919126B2

公开(公告)日：2024-03-05

申请号：US17318765

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67 ,  H01L21/677

CPC classification number: B24B37/30 ,  B24B37/042 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67742

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

公开(公告)号：US20200164481A1

公开(公告)日：2020-05-28

申请号：US16672099

申请日：2019-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

IPC: B24B37/16 ,  B24B37/013 ,  B24B49/12

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

公开(公告)号：US20190091829A1

公开(公告)日：2019-03-28

申请号：US15994088

申请日：2018-05-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC: B24B37/32 ,  H01L21/321 ,  B24B37/015 ,  B24B37/20

Abstract: In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.

公开(公告)号：US11975421B2

公开(公告)日：2024-05-07

申请号：US18149489

申请日：2023-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

IPC: B24B37/16 ,  B24B37/013 ,  B24B49/12

CPC classification number: B24B37/16 ,  B24B37/013 ,  B24B49/12

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

公开(公告)号：US20210268624A1

公开(公告)日：2021-09-02

申请号：US17318765

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lia ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/306 ,  B24B37/04 ,  H01L21/677

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

公开(公告)号：US11020837B2

公开(公告)日：2021-06-01

申请号：US15965685

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  B24B37/04 ,  H01L21/67 ,  H01L21/306 ,  H01L21/677

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

公开(公告)号：US12138735B2

公开(公告)日：2024-11-12

申请号：US16559472

申请日：2019-09-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung Chen ,  Yi-Shao Lin ,  Sheng-Tai Peng ,  Ya-Jen Sheuh ,  Hung-Lin Chen ,  Ren-Dou Lee

IPC: B24B37/20 ,  B24B37/013 ,  B24B37/04 ,  C09G1/02

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.