公开(公告)号：US20190061094A1

公开(公告)日：2019-02-28

申请号：US15882511

申请日：2018-01-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kanyu Han ,  Juster Huang ,  Fang-Chi Chien ,  Stone Chen ,  Sheng-Tai Peng

IPC: B24B37/04 ,  B24B37/24 ,  B24B57/02 ,  H01L21/321

CPC classification number: B24B37/042 ,  B24B37/013 ,  B24B37/105 ,  B24B37/12 ,  B24B37/205 ,  B24B37/245 ,  B24B57/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.

公开(公告)号：US20190143478A1

公开(公告)日：2019-05-16

申请号：US15965685

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chou-Zon LIA ,  Kit Chen ,  Stone Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/306 ,  H01L21/677 ,  B24B37/04

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.